Cobalt first layer advanced metallization for interconnects
First Claim
1. An integrated circuit device comprising:
- a substrate including a dielectric layer patterned with a pattern includes a set of features in the dielectric for a set of metal conductor structures;
an adhesion promoting layer disposed on the set of features in the patterned dielectric;
a ruthenium layer disposed on the adhesion promoting layer;
a cobalt layer having a u-shaped cross section having a thicker bottom layer than side layers disposed on the ruthenium layer filling a first portion of the set of features, wherein the cobalt layer is formed using a physical vapor deposition process;
a second metal layer disposed on the cobalt layer filling a second, remainder portion of the set of features; and
wherein a thickness of the reflowed cobalt layer from the ruthenium layer to a bottom of the second metal layer and a thickness of the second metal layer after planarization are substantially equal.
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Accused Products
Abstract
An integrated circuit device has a substrate including a dielectric layer patterned with a pattern which includes a set of features in the dielectric for a set of metal conductor structures. An adhesion promoting layer is disposed on the set of features in the patterned dielectric. A ruthenium layer is disposed on the adhesion promoting layer. A cobalt layer is disposed on the ruthenium layer filling a first portion of the set of features. The cobalt layer has a u-shaped cross section having a thicker bottom layer than side layers. The cobalt layer is formed using a physical vapor deposition process. A metal layer is disposed on the cobalt layer filling a second, remainder portion of the set of features.
63 Citations
13 Claims
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1. An integrated circuit device comprising:
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a substrate including a dielectric layer patterned with a pattern includes a set of features in the dielectric for a set of metal conductor structures; an adhesion promoting layer disposed on the set of features in the patterned dielectric; a ruthenium layer disposed on the adhesion promoting layer; a cobalt layer having a u-shaped cross section having a thicker bottom layer than side layers disposed on the ruthenium layer filling a first portion of the set of features, wherein the cobalt layer is formed using a physical vapor deposition process; a second metal layer disposed on the cobalt layer filling a second, remainder portion of the set of features; and wherein a thickness of the reflowed cobalt layer from the ruthenium layer to a bottom of the second metal layer and a thickness of the second metal layer after planarization are substantially equal. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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Specification