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Bump on pad (BOP) bonding structure in semiconductor packaged device

  • US 10,163,839 B2
  • Filed: 08/11/2017
  • Issued: 12/25/2018
  • Est. Priority Date: 07/31/2012
  • Status: Active Grant
First Claim
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1. A package structure comprising:

  • an integrated circuit package comprising a conductive post, the conductive post having a first plan-view shape;

    a substrate bonded to the integrated circuit package, the substrate comprising;

    a first dielectric layer;

    a first contact pad over the first dielectric layer, a bottom surface of the first contact pad being in physical contact with a topmost surface of the first dielectric layer, the first contact pad having a second plan-view shape, a line extending through a first center of the first plan-view shape and a second center of the second plan-view shape intersecting the first contact pad at an angle having less than 90 degrees, the first plan-view shape being a first racetrack shape and the second plan-view shape being a second racetrack shape; and

    a second dielectric layer over the first contact pad and the first dielectric layer, the second dielectric layer being in physical contact with the topmost surface of the first dielectric layer; and

    a solder layer extending through the second dielectric layer, the solder layer electrically and mechanically coupling the conductive post to the first contact pad.

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