Bump on pad (BOP) bonding structure in semiconductor packaged device
First Claim
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1. A package structure comprising:
- an integrated circuit package comprising a conductive post, the conductive post having a first plan-view shape;
a substrate bonded to the integrated circuit package, the substrate comprising;
a first dielectric layer;
a first contact pad over the first dielectric layer, a bottom surface of the first contact pad being in physical contact with a topmost surface of the first dielectric layer, the first contact pad having a second plan-view shape, a line extending through a first center of the first plan-view shape and a second center of the second plan-view shape intersecting the first contact pad at an angle having less than 90 degrees, the first plan-view shape being a first racetrack shape and the second plan-view shape being a second racetrack shape; and
a second dielectric layer over the first contact pad and the first dielectric layer, the second dielectric layer being in physical contact with the topmost surface of the first dielectric layer; and
a solder layer extending through the second dielectric layer, the solder layer electrically and mechanically coupling the conductive post to the first contact pad.
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Abstract
The embodiments described above provide enlarged overlapping surface areas of bonding structures between a package and a bonding substrate. By using elongated bonding structures on either the package and/or the bonding substrate and by orienting such bonding structures, the bonding structures are designed to withstand bonding stress caused by thermal cycling to reduce cold joints.
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Citations
20 Claims
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1. A package structure comprising:
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an integrated circuit package comprising a conductive post, the conductive post having a first plan-view shape; a substrate bonded to the integrated circuit package, the substrate comprising; a first dielectric layer; a first contact pad over the first dielectric layer, a bottom surface of the first contact pad being in physical contact with a topmost surface of the first dielectric layer, the first contact pad having a second plan-view shape, a line extending through a first center of the first plan-view shape and a second center of the second plan-view shape intersecting the first contact pad at an angle having less than 90 degrees, the first plan-view shape being a first racetrack shape and the second plan-view shape being a second racetrack shape; and a second dielectric layer over the first contact pad and the first dielectric layer, the second dielectric layer being in physical contact with the topmost surface of the first dielectric layer; and a solder layer extending through the second dielectric layer, the solder layer electrically and mechanically coupling the conductive post to the first contact pad. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A package structure comprising:
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a die package comprising a conductive post, the conductive post having a first plan-view shape; a substrate bonded to the die package, the substrate comprising; a dielectric layer; a contact pad over the dielectric layer, a bottom surface of the contact pad being in physical contact with a topmost surface of the dielectric layer, the contact pad having a second plan-view shape, a first center of the first plan-view shape being laterally spaced apart from a second center of the second plan-view shape, the first plan-view shape being a first racetrack shape and the second plan-view shape being a second racetrack shape; and a solder resist layer over the contact pad and the dielectric layer, the solder resist layer being in physical contact with the topmost surface of the dielectric layer; and a solder layer extending through the solder resist layer, the solder layer being in physical contact with the conductive post and the contact pad. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A package structure comprising:
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a die package comprising a first conductive post and a second conductive post, the first conductive post being disposed at a first distance from a center of the die package, the second conductive post being disposed at a second distance from the center of the die package, the second distance being different from the first distance; a substrate bonded to the die package, the substrate comprising; a dielectric layer; a first contact pad and a second contact pad over the dielectric layer, a bottom surface of the first contact pad being in physical contact with a topmost surface of the dielectric layer; and a passivation layer over the first contact pad and the second contact pad, the passivation layer being in physical contact with the topmost surface of the dielectric layer; a first solder layer extending through the passivation layer, the first solder layer electrically and mechanically coupling the first conductive post to the first contact pad, the first conductive post having a first plan-view shape, the first contact pad having a second plan-view shape, a center of the first plan-view shape being laterally spaced apart from a center of the second plan-view shape by a third distance, the first plan-view shape being a first racetrack shape and the second plan-view shape being a second racetrack shape; and a second solder layer extending through the passivation layer, the second solder layer electrically and mechanically coupling the second conductive post to the second contact pad, the second conductive post having a third plan-view shape, the second contact pad having a fourth plan-view shape, a center of the third plan-view shape being laterally spaced apart from a center of the fourth plan-view shape by a fourth distance, the fourth distance being different from the third distance, the third plan-view shape being a third racetrack shape and the fourth plan-view shape being a fourth racetrack shape. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification