Molded chip fabrication method and apparatus
First Claim
1. An apparatus for coating a plurality of semiconductor devices, comprising:
- a mold housing comprising;
a top rigid block support;
a bottom rigid block support to hold semiconductor devices, said semiconductor devices comprising positive and negative terminals;
a formation cavity between said top and bottom block supports;
two or more spacers, coupled between the top rigid block support and the bottom rigid block support, wherein a coating material can be introduced into said formation cavity for at least partially covering said semiconductor devices, in which the two or more spacers define a thickness of the coating material applied to the plurality of semiconductor devices in said formation cavity, wherein said mold housing protects said positive and negative terminals from said coating material; and
two adhesive films, wherein a first of said two adhesive films is on said top rigid block support and a second of said two adhesive films is on said bottom rigid block support between said two or more spacers, said two adhesive films covering said positive and negative terminals of said semiconductor devices such that said terminals are protected from being covered by said coating material when said coating material is introduced into said formation cavity.
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Accused Products
Abstract
A method and apparatus for coating a plurality of semiconductor devices that is particularly adapted to coating LEDs with a coating material containing conversion particles. One method according to the invention comprises providing a mold with a formation cavity. A plurality of semiconductor devices are mounted within the mold formation cavity and a curable coating material is injected or otherwise introduced into the mold to fill the mold formation cavity and at least partially cover the semiconductor devices. The coating material is cured so that the semiconductor devices are at least partially embedded in the cured coating material. The cured coating material with the embedded semiconductor devices is removed from the formation cavity. The semiconductor devices are separated so that each is at least partially covered by a layer of the cured coating material. One embodiment of an apparatus according to the invention for coating a plurality of semiconductor devices comprises a mold housing having a formation cavity arranged to hold semiconductor devices. The formation cavity is also arranged so that a curable coating material can be injected into and fills the formation cavity to at least partially covering the semiconductor devices.
228 Citations
10 Claims
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1. An apparatus for coating a plurality of semiconductor devices, comprising:
a mold housing comprising; a top rigid block support; a bottom rigid block support to hold semiconductor devices, said semiconductor devices comprising positive and negative terminals; a formation cavity between said top and bottom block supports; two or more spacers, coupled between the top rigid block support and the bottom rigid block support, wherein a coating material can be introduced into said formation cavity for at least partially covering said semiconductor devices, in which the two or more spacers define a thickness of the coating material applied to the plurality of semiconductor devices in said formation cavity, wherein said mold housing protects said positive and negative terminals from said coating material; and two adhesive films, wherein a first of said two adhesive films is on said top rigid block support and a second of said two adhesive films is on said bottom rigid block support between said two or more spacers, said two adhesive films covering said positive and negative terminals of said semiconductor devices such that said terminals are protected from being covered by said coating material when said coating material is introduced into said formation cavity. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
Specification