Flexible electronic circuits including shape memory materials
First Claim
Patent Images
1. A flexible electronic circuit having an embedded signal trace with a dynamic impedance value, the flexible electronic circuit comprising:
- a first dielectric structure that includes;
a first ground layer overlying a first flexible dielectric layer, the first ground layer defining a ground plane; and
an embedded signal trace adjacent to the first flexible dielectric layer, the embedded signal trace defining a signal plane; and
a second dielectric structure overlying a second ground layer, the second dielectric structure including;
a dielectric material adjacent to the embedded signal trace; and
a second flexible dielectric layer separated from the dielectric material by a mechanical member, the second flexible dielectric layer having a shape memory alloy (SMA) material embedded therein,wherein application of heat results in a change in the SMA material from a deformed state to a non-deformed state, the change resulting in movement of the signal plane with respect to the ground plane in order to vary an impedance value of the embedded signal trace.
1 Assignment
0 Petitions
Accused Products
Abstract
A flexible electronic circuit includes a shape memory material disposed within a flexible dielectric material.
-
Citations
14 Claims
-
1. A flexible electronic circuit having an embedded signal trace with a dynamic impedance value, the flexible electronic circuit comprising:
-
a first dielectric structure that includes; a first ground layer overlying a first flexible dielectric layer, the first ground layer defining a ground plane; and an embedded signal trace adjacent to the first flexible dielectric layer, the embedded signal trace defining a signal plane; and a second dielectric structure overlying a second ground layer, the second dielectric structure including; a dielectric material adjacent to the embedded signal trace; and a second flexible dielectric layer separated from the dielectric material by a mechanical member, the second flexible dielectric layer having a shape memory alloy (SMA) material embedded therein, wherein application of heat results in a change in the SMA material from a deformed state to a non-deformed state, the change resulting in movement of the signal plane with respect to the ground plane in order to vary an impedance value of the embedded signal trace. - View Dependent Claims (2, 3, 4, 5, 6, 7)
-
-
8. A flexible electronic circuit having an embedded signal trace with a dynamic impedance value, the flexible electronic circuit comprising:
-
a first dielectric structure that includes; a first ground layer overlying a first dielectric layer; and an embedded signal trace adjacent to the first dielectric layer, the embedded signal trace defining a signal plane; and a second dielectric structure overlying a second ground layer that defines a ground plane, the second dielectric structure including; a second dielectric layer adjacent to the embedded signal trace; and a flexible dielectric layer separated from the second dielectric layer by a mechanical member, the flexible dielectric layer having a shape memory alloy (SMA) material embedded therein, wherein application of heat results in a change in the SMA material from a deformed state to a non-deformed state, the change resulting in movement of the ground plane with respect to the signal plane in order to vary an impedance value of the embedded signal trace. - View Dependent Claims (9, 10, 11, 12, 13, 14)
-
Specification