Wireless communication device

• US 10,164,321 B2
• Filed: 12/05/2016
• Issued: 12/25/2018
• Est. Priority Date: 01/05/2011
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Kimura, Ikuhei, Ikemoto, Nobuo
• Primary Examiner(s): Johnson, Sonji N
• Application Number:
  US15/368,817
• Publication Number:
  US 20170084981A1
• Time in Patent Office: 750 Days
• CPC Class Codes: G06K 19/07773 Antenna details antennas for wireless devices, e.g. RFID tags, in general H01Q1/22
• CPC Class Codes: G06K 19/07783 the coil being planar
• CPC Class Codes: G06K 19/07784 the inductive antenna consisting of a plurality of coils stacked on top of one another
• CPC Class Codes: G06K 19/07786 the antenna being of the HF type, such as a dipole
• CPC Class Codes: G06K 19/07794 the record carrier comprising a booster or auxiliary antenna in addition to the antenna connected directly to the integrated circuit
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 1/50 Structural association of antennas with earthing switches, lead-in devices or lightning protectors
• CPC Class Codes: H01Q 9/065 Microstrip dipole antennas patch antenna H01Q9/0407
• CPC Class Codes: H01Q 9/16 with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole H01Q9/44 takes precedence
• CPC Class Codes: H04W 4/80 Services using short range communication, e.g. near-field communication [NFC], radio-frequency identification [RFID] or low energy communication

Abstract

A compact wireless communication includes a first radiating element and a second radiating element, which define and function as a dipole antenna, a feeder circuit including a wireless IC chip coupled with the first and second radiating elements, and a feeder substrate that is provided with the wireless IC chip. The first radiating element is provided to the feeder substrate. The second radiating element is provided to a substrate other than the feeder substrate.

Claims

1. A wireless communication device, comprising:

a wireless IC chip including first and second input/output electrodes;

a first substrate including a first element connected to the first input/output electrode, a second element connected to the second input/output electrodes, and an inductance element provided between the first element and the second element; and

a second substrate including a radiating element, wherein

the first substrate is attached to the second substrate, and the second element of the first substrate is connected to the radiating element of the second substrate.

2. The wireless communication device according to claim 1, wherein one end of the first element is connected to the first input/output electrode of the wireless IC chip and another end of the first element is an open end.

3. The wireless communication device according to claim 1, wherein one end of the second element is connected to the second input/output electrode of the wireless IC chip and another end of the second element is connected to the radiating element of the second substrate.

4. The wireless communication device according to claim 1, wherein the first element is connected to one end of the inductance element and the second element is connected to another end of the inductance element.

5. The wireless communication device according to claim 1, wherein the second element of the first substrate is connected to the radiating element of the second substrate via a capacitance.

6. The wireless communication device according to claim 1, wherein a portion of the second element of the first substrate faces a portion of the radiating element of the second substrate.

7. The wireless communication device according to claim 6, wherein the first element of the first substrate is not overlapped with the radiating element of the second substrate.

8. The wireless communication device according to claim 1, wherein the inductance element of the first substrate defines a matching circuit.

9. The wireless communication device according to claim 8, wherein the inductance element of the matching circuit is connected between the first and second input/output electrodes.

10. The wireless communication device according to claim 1, wherein the wireless IC chip processes a high-frequency signal in a UHF-band.

11. The wireless communication device according to claim 1, wherein the second substrate is larger than the first substrate.

12. The wireless communication device according to claim 1, wherein the second substrate is an article;

and the first substrate is bonded to the article.