Voltage regulator with jitter control

• US 10,164,517 B2
• Filed: 08/17/2016
• Issued: 12/25/2018
• Est. Priority Date: 08/17/2016
• Status: Active Grant

• Current Assignee: Altera Corporation (Intel Corporation)
• Original Assignee: Altera Corporation (Intel Corporation)
• Inventors: Lim, Teik Wah, Lotfi, Ashraf
• Primary Examiner(s): Hiltunen, Thomas J
• Application Number:
  US15/239,606
• Publication Number:
  US 20180054110A1
• Time in Patent Office: 860 Days
• CPC Class Codes: H02M 1/14 Arrangements for reducing ripples from dc input or output
• CPC Class Codes: H02M 1/143 using compensating arrangements for reducing noise from the supply in transmission systems H04B15/005

Abstract

A voltage regulator package includes a voltage regulator module that outputs a voltage signal of a particular voltage level through an output terminal is provided. The voltage regulator module may be switched on according to a periodic signal having a periodic signal frequency as a variable. The periodic signal frequency may be tuned to reduce impedance, jitter, or noise.

Claims

1. A voltage regulator package, comprising:

a voltage regulator module that outputs a voltage signal of a particular voltage level through an output terminal, wherein the voltage regulator module is switched on according to a periodic signal having a periodic signal frequency as a variable; and

a trim circuit that statically defines the periodic signal frequency of the periodic signal to reduce an output impedance value on the output terminal.

2. The voltage regulator package as defined in claim 1, wherein the trim circuit is trimmed to cause the periodic signal frequency to result in a relatively lowest output impedance value on the output terminal.

3. The voltage regulator package as defined in claim 1, comprising:

an oscillator circuit coupled to the voltage regulator module, wherein the oscillator circuit generates the periodic signal based at least in part on the periodic signal frequency defined by the trim circuit.

4. The voltage regulator package as defined in claim 3, wherein the trim circuit is coupled directly to the oscillator circuit.

5. The voltage regulator package as defined in claim 1, wherein the trim circuit comprises fuse circuitry that comprises a plurality of fuse elements, wherein different combinations of the fuse elements correspond to different frequency values of the periodic signal.

6. The voltage regulator package as defined in claim 1, wherein the voltage regulator module comprises a switching voltage regulator module.

7. The voltage regulator package as defined in claim 6, wherein the voltage regulator module comprises a boost converter circuit, a buck-boost converter circuit or any combination thereof.

8. The voltage regulator package as defined in claim 1, comprising:

at least one decoupling capacitor that is coupled in a shunt manner to the output terminal of the voltage regulator module.

9. The voltage regulator package as defined in claim wherein the voltage regulator package is coupled to an external decoupling capacitor in a shunt manner to the output terminal of the voltage regulator module, wherein a capacitance value of the external decoupling capacitor is less than a capacitance value of the at least one decoupling capacitor.

10. An integrated circuit package, comprising:

a package substrate;

an integrated circuit die formed on the package substrate; and

a voltage regulator device formed on the package substrate, wherein the voltage regulator device outputs a voltage signal through an output terminal for the integrated circuit die, wherein the voltage regulator device is activated based at least in part on a periodic signal having a periodic signal frequency as a parameter, and wherein the periodic signal frequency is configured to be tunable to a static value to reduce an output impedance value on the output terminal.

11. The integrated circuit package as defined in claim 10, wherein the integrated circuit die is coupled to the voltage regulator device through a wire interconnection.

12. The integrated circuit package as defined in claim 10, wherein a decoupling capacitor is formed on the package substrate and is coupled in parallel to the voltage regulator device and the integrated circuit die.

13. The integrated circuit package as defined in claim 10, wherein the integrated circuit die comprises a field programmable gate array, an application specific integrated circuit or an application specific standard product, or any combination thereof.

14. The integrated circuit package as defined in claim 10, wherein the voltage regulator device comprises:

an oscillator circuit that generates the periodic signal having the periodic signal frequency.

15. The integrated circuit package as defined in claim 14, wherein the voltage regulator device comprises:

a trim circuit that is programmable to tune the periodic signal frequency.