Coupling structure for inductive device

• US 10,164,570 B2
• Filed: 01/09/2018
• Issued: 12/25/2018
• Est. Priority Date: 11/08/2013
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Chen, Huan-Neng, Jou, Chewn-Pu
• Primary Examiner(s): Gannon, Levi
• Application Number:
  US15/866,182
• Publication Number:
  US 20180131325A1
• Time in Patent Office: 350 Days
• Field of Search: 331 2, 331 36 L, 331 46, 331 55, 331 56, 331117 FE, 331117 R, 331167, 331172, 331181, 336173, 336180, 336182, 336183, 336188, 336220
• CPC Class Codes: H01F 19/04 Transformers or mutual inductances suitable for handling frequencies considerably beyond the audio range resonant circuits H03H
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H01F 27/2871 Pancake coils
• CPC Class Codes: H01F 27/288 Shielding
• CPC Class Codes: H01F 38/14 Inductive couplings for wireless supply or distribution of electric power using inductive coupling H02J50/10
• CPC Class Codes: H01F 5/04 Arrangements of electric connections to coils, e.g. leads
• CPC Class Codes: H03B 5/08 with frequency-determining element comprising lumped inductance and capacitance
• CPC Class Codes: H03B 5/1212 the amplifier comprising a pair of transistors, wherein an output terminal of each being connected to an input terminal of the other, e.g. a cross coupled pair
• CPC Class Codes: H03B 5/1228 the amplifier comprising one or more field effect transistors
• CPC Class Codes: H03B 5/1243 the means comprising voltage variable capacitance diodes
• CPC Class Codes: H03B 5/1256 the means comprising a variable inductance
• CPC Class Codes: H03B 5/1296 the feedback circuit comprising a transformer
• CPC Class Codes: H03J 2200/10 Tuning of a resonator by means of digitally controlled capacitor bank
• CPC Class Codes: H03L 7/00 Automatic control of frequency or phase; Synchronisation
• CPC Class Codes: H03L 7/24 using a reference signal directly applied to the generator

Abstract

A circuit includes a coupling structure and a first inductive device. The coupling structure includes two or more conductive loops and a set of conductive paths electrically connecting the two or more conductive loops. The first inductive device is magnetically coupled with a first conductive loop of the two or more conductive loops.

Claims

1. An integrated circuit device comprising:

a first oscillator comprising a first inductive device;

a second oscillator being electrically separated from the first oscillator, the second oscillator comprising a second inductive device, the second inductive device and the first inductive device being separated by a first distance; and

a first continuous conductive material surrounding but electrically separated from both the first inductive device and the second inductive device, wherein the first continuous conductive material renders a mutual inductance between the first inductive device and the second inductive device independent of the first distance.

2. The integrated circuit device of claim 1, wherein the first continuous conductive material comprises:

a first conductive loop;

a second conductive loop; and

a set of conductive paths electrically connecting the first conductive loop and the second conductive loop.

3. The integrated circuit device of claim 2, wherein the first conductive loop is an octagon loop.

4. The integrated circuit device of claim 1, wherein the first continuous conductive material is located in multiple interconnection layers.

5. The integrated circuit device of claim 1, wherein the first continuous conductive material is located in at least two chips.

6. The integrated circuit device of claim 1, wherein the first inductive device has a first signal port with a first port direction, the second inductive device has a second signal port with a second port direction different from the first port direction.

7. The integrated circuit device of claim 1, wherein the first inductive device has a first signal port with a first port direction and the second inductive device has a second signal port with the first port direction.

8. An integrated circuit device comprising:

a first inductive device and a second inductive device separated by a first space located directly between the first inductive device and the second inductive device, the first inductive device being part of a first oscillator, the second inductive device being part of a second oscillator, the second oscillator being electrically separated from the first oscillator; and

a first conductive material encircling but not touching both the first inductive device and the second inductive device, the first conductive material extending into the first space.

9. The integrated circuit device of claim 8, wherein the first conductive material comprises:

a first loop;

a second loop;

a first conductive path connecting the first loop to the second loop; and

a second conductive path connecting the first loop to the second loop.

10. The integrated circuit device of claim 9, wherein the first conductive path crosses over the second conductive path.

11. The integrated circuit device of claim 9, wherein the first conductive path has a first angled corner.

12. The integrated circuit device of claim 11, wherein the second conductive path has a second angled corner.

13. The integrated circuit device of claim 12, wherein the first conductive path crosses over the second conductive path.

14. An integrated circuit device comprising:

a first oscillator comprising a first inductive device;

a second oscillator comprising a second inductive device, the second oscillator being electrically separated from the first oscillator; and

a first continuous conductive material electrically separated from both the first inductive device and the second inductive device, the first continuous conductive material comprising;

a first loop encircling the first inductive device;

a second loop encircling the second inductive device; and

a connecting piece, the connecting piece being disposed directly between the first loop and the second loop.

15. The integrated circuit device of claim 14, wherein the first continuous conductive material is located in multiple interconnection layers.

16. The integrated circuit device of claim 14, wherein the first continuous conductive material is located in at least two chips.

17. The integrated circuit device of claim 14, wherein the first inductive device has a first signal port with a first port direction and the second inductive device has a second signal port with a second port direction different from the first port direction.

18. The integrated circuit device of claim 14, wherein the first loop is octagonal.

19. The integrated circuit device of claim 14, wherein the first loop is circular.

20. The integrated circuit device of claim 14, wherein the first inductive device has a first signal port with a first port direction and the second inductive device has a second signal port with the first port direction.