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Solder joint structure of flexible printed circuit board

  • US 10,165,690 B2
  • Filed: 06/17/2016
  • Issued: 12/25/2018
  • Est. Priority Date: 06/19/2015
  • Status: Active Grant
First Claim
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1. A solder joint structure connecting a first board composed of a first material having flexibility and a second board composed of a second material that is different from the first material, wherein:

  • the first board includes a plurality of electrode pads formed along an end part of the first board, each of the plurality of electrode pads includes two corresponding conductive electrodes having generally the same shape on both faces sandwiching the first board, the two corresponding conductive electrodes are mutually connected by at least one through hole, the two corresponding conductive electrodes, including an inner part of the through hole, have a solder layer formed thereon, and the two corresponding conductive electrodes are further mutually connected by a side face electrode formed on a side face of the end part of the first board;

    the second board includes a plurality of electrode pads formed along an end part of the second board to face the conductive electrodes on one face of the first board; and

    the conductive electrodes on the one face of the first board and the plurality of facing electrode pads on the second board are solder joined with the solder layer, and the solder joint is configured such that a joined state of a soldered portion on the side face electrode formed continuously from the solder joint is visible from the second board side of the solder joint.

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