Thermal detector array configured to detect thermal radiation from the integrated circuit

• US 10,168,222 B2
• Filed: 03/30/2017
• Issued: 01/01/2019
• Est. Priority Date: 03/30/2017
• Status: Active Grant

• Current Assignee: Qualcomm, Inc.
• Original Assignee: Qualcomm, Inc.
• Inventors: Goruganthu, Rama Rao, Merrikh, Ali Akbar
• Primary Examiner(s): Kim, Christine S
• Application Number:
  US15/474,914
• Publication Number:
  US 20180283959A1
• Time in Patent Office: 642 Days
• CPC Class Codes: G01J 2005/0077 Imaging
• CPC Class Codes: G01J 2005/106 Arrays
• CPC Class Codes: G01J 5/0096 for measuring wires, electrical contacts or electronic systems
• CPC Class Codes: G01J 5/025 Interfacing a pyrometer to an external device or network; User interface
• CPC Class Codes: G01J 5/061 by controlling the temperature of the apparatus or parts thereof, e.g. using cooling means or thermostats
• CPC Class Codes: G01J 5/0806 Focusing or collimating elements, e.g. lenses or concave mirrors
• CPC Class Codes: G01J 5/0808 Convex mirrors
• CPC Class Codes: G01J 5/10 using electric radiation detectors

Abstract

An apparatus is disclosed that comprises an integrated circuit and a thermal detector array configured to detect thermal radiation from the integrated circuit. A method is disclosed that comprises providing an integrated circuit and disposing a thermal detector array so as to detect thermal radiation from the integrated circuit. Another apparatus is disclosed that comprises means for processing and means for detecting thermal radiation from the means for processing.

Claims

1. An apparatus comprising:

an integrated circuit substrate;

an integrated circuit, wherein the integrated circuit is disposed on a top surface of the integrated circuit substrate;

a thermal detector array substrate;

a thermal detector array configured to detect thermal radiation from the integrated circuit, wherein the thermal detector array is disposed on a bottom surface of the thermal detector array substrate; and

one or more spacers disposed on the top surface of the integrated circuit substrate;

wherein the one or more spacers are disposed between the top surface of the integrated circuit substrate and the bottom surface of the thermal detector array substrate.

2. The apparatus of claim 1, wherein a distance between a top surface of the integrated circuit and a bottom surface of the thermal detector array is within a range of distances between twenty micrometers and one-thousand micrometers.

3. The apparatus of claim 1, further comprising:

a lens disposed between the top surface of the integrated circuit and a bottom surface of the thermal detector array.

4. The apparatus of claim 1, further comprising a temperature control module configured to:

receive a thermal detection signal from the thermal detector array, the thermal detection signal indicating an amount and/or location of thermal radiation detected by the thermal detector array;

generate a temperature control signal in response to receiving of the thermal detection signal; and

transmit the temperature control signal to the integrated circuit, a portion or component of the integrated circuit, an active coolant system, or any combination thereof.

5. The apparatus of claim 4, wherein the temperature control signal comprises one or more instructions for reducing heat generation, one or more instructions for directing an active coolant system, or any combination thereof.

6. The apparatus of claim 1, wherein the apparatus is incorporated into a set top box, a music player, a video player, an entertainment unit, a navigation device, a communications device, a personal digital assistant (PDA), a fixed location data unit, or a computer, or any combination thereof.

7. An apparatus comprising:

an integrated circuit substrate;

an integrated circuit, wherein the integrated circuit is disposed on a top surface of the integrated circuit substrate;

a thermal detector array substrate;

a thermal detector array configured to detect thermal radiation from the integrated circuit; and

one or more conductive couplings disposed between the integrated circuit substrate and the thermal detector array substrate;

wherein the one or more conductive couplings are configured to conduct a thermal detection signal from the thermal detector array substrate to the integrated circuit substrate, the thermal detection signal indicating an amount and/or location of thermal radiation detected by the thermal detector array.

8. An apparatus comprising:

an integrated circuit substrate;

an integrated circuit, wherein the integrated circuit is disposed on a top surface of the integrated circuit substrate;

a thermal detector array substrate;

a thermal detector array configured to detect thermal radiation from the integrated circuit;

a memory circuit substrate;

a memory circuit, wherein the memory circuit is disposed on the memory circuit substrate; and

one or more conductive couplings disposed on a top surface of the thermal detector array substrate and a bottom surface of the memory circuit substrate.

9. An apparatus comprising:

an integrated circuit;

a thermal detector array;

a substrate, wherein the integrated circuit and the thermal detector array are disposed on a top surface of the substrate;

a mirror having a reflective bottom surface;

one or more spacers disposed between the substrate and the mirror.

10. A method comprising:

providing an integrated circuit;

disposing the integrated circuit on a top surface of an integrated circuit substrate;

providing a thermal detector array;

disposing the thermal detector array on a bottom surface of a thermal detector array substrate so as to detect thermal radiation from the integrated circuit;

disposing one or more spacers on the top surface of the integrated circuit substrate, wherein disposing the one or more spacers comprises disposing the one or more spacers between the top surface of the integrated circuit substrate and the bottom surface of the thermal detector array substrate.

11. The method of claim 10, wherein disposing the one or more spacers comprises:

disposing a top surface of the integrated circuit at a distance from a bottom surface of the thermal detector array, wherein the distance is within a range of distances between twenty micrometers and one-thousand micrometers.

12. The method of claim 10, further comprising:

disposing a lens between the top surface of the integrated circuit and a bottom surface of the thermal detector array.

13. The method of claim 10, further comprising:

receiving a thermal detection signal from the thermal detector array, the thermal detection signal indicating an amount and/or location of thermal radiation detected by the thermal detector array;

generating a temperature control signal in response to receiving of the thermal detection signal; and

transmitting the temperature control signal to the integrated circuit, a component of the integrated circuit, or any combination thereof.

14. The method of claim 13, wherein the temperature control signal comprises one or more instructions for reducing heat generation, one or more instructions for directing a flow of cooling fluid, or any combination thereof.

15. The method of claim 10, wherein the method further comprises incorporating the thermal detector array into a set top box, a music player, a video player, an entertainment unit, a navigation device, a communications device, a personal digital assistant (PDA), a fixed location data unit, or a computer, or any combination thereof.

16. A method comprising:

providing an integrated circuit;

disposing the integrated circuit on a top surface of an integrated circuit substrate;

providing a thermal detector array;

disposing the thermal detector array on a bottom surface of a thermal detector array substrate so as to detect thermal radiation from the integrated circuit;

disposing one or more conductive couplings between the integrated circuit substrate and the thermal detector array substrate;

conducting a thermal detection signal from the thermal detector array substrate to the integrated circuit substrate via the one or more conductive couplings, the thermal detection signal indicating an amount and/or location of thermal radiation detected by the thermal detector array.

17. A method comprising:

providing an integrated circuit;

disposing the integrated circuit on a top surface of an integrated circuit substrate;

providing a thermal detector array;

disposing the thermal detector array on a bottom surface of a thermal detector array substrate so as to detect thermal radiation from the integrated circuit;

providing a memory circuit;

disposing the memory circuit on a memory circuit substrate; and

disposing one or more conductive couplings on a top surface of the thermal detector array substrate and a bottom surface of the memory circuit substrate.

18. A method comprising:

providing an integrated circuit;

providing a thermal detector array configured to detect thermal radiation from the integrated circuit;

disposing the integrated circuit and the thermal detector array on a top surface of a substrate;

providing a mirror having a reflective bottom surface;

disposing one or more spacers between the substrate and the mirror.

19. An apparatus comprising:

means for processing;

means for supporting the means for processing, wherein the means for processing is disposed on a top surface of the means for supporting the means for processing;

means for detecting thermal radiation from the means for processing;

means for supporting the means for detecting thermal radiation, wherein the means for detecting thermal radiation is disposed on a bottom surface of the means for supporting the means for detecting thermal radiation; and

means for spacing disposed on the top surface of the means for supporting the means for processing;

wherein the means for spacing are disposed between the top surface of the means for supporting the means for processing and the bottom surface of the means for supporting the means for detecting thermal radiation.

20. The apparatus of claim 19, further comprising a means for controlling temperature configured to:

receive a thermal detection signal from the means for detecting thermal radiation, the thermal detection signal indicating an amount and/or location of thermal radiation detected by the means for detecting thermal radiation;

generate a temperature control signal in response to receiving of the thermal detection signal; and

transmit the temperature control signal to the means for processing, a component of the means for processing, or any combination thereof.

21. The apparatus of claim 20, wherein the temperature control signal comprises one or more instructions for reducing heat generation, one or more instructions for directing a flow of cooling fluid, or any combination thereof.

22. An apparatus comprising:

means for processing;

means for supporting the means for processing, wherein the means for processing is disposed on a top surface of the means for supporting the means for processing;

means for detecting thermal radiation from the means for processing;

means for supporting the means for detecting thermal radiation; and

means for conductively coupling disposed between the means for supporting the means for processing and the means for supporting the means for detecting thermal radiation;

wherein the means for conductively coupling is configured to conduct a thermal detection signal from the means for supporting the means for detecting thermal radiation to the means for supporting the means for processing, the thermal detection signal indicating an amount and/or location of thermal radiation detected by the means for detecting thermal radiation.

23. An apparatus comprising:

means for processing;

means for supporting the means for processing, wherein the means for processing is disposed on a top surface of the means for supporting the means for processing;

means for detecting thermal radiation from the means for processing;

means for supporting the means for detecting thermal radiation; and

means for storing data;

means for supporting the means for storing data, wherein the means for storing data is disposed on the means for supporting the means for storing data; and

means for conductively coupling disposed on a top surface of the means for supporting the means for detecting thermal radiation and a bottom surface of the means for supporting the means for storing data.

24. An apparatus comprising:

means for processing;

means for detecting thermal radiation from the means for processing;

means for supporting, wherein the means for processing and the means for detecting thermal radiation are disposed on a top surface of the means for supporting;

means for reflecting; and

means for spacing disposed between the means for supporting and the means for reflecting.