Micro-electro-mechanical system (MEMS) and related actuator bumps, methods of manufacture and design structures

• US 10,170,262 B2
• Filed: 05/16/2016
• Issued: 01/01/2019
• Est. Priority Date: 06/20/2011
• Status: Active Grant

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Jahnes, Christopher V., Stamper, Anthony K.
• Primary Examiner(s): Andrews, Michael
• Application Number:
  US15/155,417
• Publication Number:
  US 20160257556A1
• Time in Patent Office: 960 Days
• Field of Search: 310309
• CPC Class Codes: B81B 2201/016 having a bridge fixed on two ends and connected to one or more dimples
• CPC Class Codes: B81B 2203/0118 Cantilevers
• CPC Class Codes: B81B 2203/04 Electrodes
• CPC Class Codes: B81B 3/001 Structures having a reduced contact area, e.g. with bumps or with a textured surface
• CPC Class Codes: B81B 7/0006 Interconnects
• CPC Class Codes: B81C 1/0015 Cantilevers switches using MEMS H01H1/0036; electrostatic relays using micromechanics H01H59/0009; microelectro-mechanical resonators H03H9/02244
• CPC Class Codes: B81C 1/00293 maintaining a controlled atmosphere with processes not provided for in B81C1/00285
• CPC Class Codes: B81C 2203/0145 Hermetically sealing an opening in the lid
• CPC Class Codes: G06F 2115/04 Micro electro-mechanical systems [MEMS]
• CPC Class Codes: G06F 30/30 Circuit design
• CPC Class Codes: G06F 30/39 Circuit design at the physical level physical level design for reconfigurable circuits G06F30/347
• CPC Class Codes: H01H 1/0036 Switches making use of microelectromechanical systems [MEMS] for electromagnetic relays H01H50/005; for electrostatic relays H01H59/0009
• CPC Class Codes: H01H 2001/0057 the contact materials containing refractory materials, e.g. tungsten
• CPC Class Codes: H01H 59/0009 making use of micromechanics
• CPC Class Codes: Y10T 29/49121 Beam lead frame or beam lead device

Abstract

Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are provided. The method of forming a MEMS structure includes forming fixed actuator electrodes and a contact point on a substrate. The method further includes forming a MEMS beam over the fixed actuator electrodes and the contact point. The method further includes forming an array of actuator electrodes in alignment with portions of the fixed actuator electrodes, which are sized and dimensioned to prevent the MEMS beam from collapsing on the fixed actuator electrodes after repeating cycling. The array of actuator electrodes are formed in direct contact with at least one of an underside of the MEMS beam and a surface of the fixed actuator electrodes.

Claims

1. A MEMS structure, comprising:

fixed actuator electrodes and a contact point;

a MEMS beam over the fixed actuator electrodes and the contact point; and

an array of actuator bumps in alignment with portions of the fixed actuator electrodes, which are sized and dimensioned to prevent the MEMS beam from contacting an actuator portion of the fixed actuator electrodes, wherein the array of actuator bumps are in direct contact with and extending from at least one of an underside of the MEMS beam and a surface of the fixed actuator electrodes, and the array of actuator bumps are composed of a dielectric material.

2. The MEMS structure of claim 1, wherein the array of actuator bumps are a predetermined height and width.

3. The MEMS structure of claim 1, wherein the array of actuator bumps are formed under an insulator material and between portions of conductive material forming the MEMS beam.

4. The MEMS structure of claim 1, wherein an additional array of actuator bumps are formed on a wiring layer, and extend towards the MEMS beam.

5. The MEMS structure of claim 1, wherein the array of actuator bumps extend downward from the MEMS beam.

6. The MEMS structure of claim 1, wherein the array of actuator bumps have differing widths and differing depths.

7. The MEMS structure of claim 6, wherein a plurality of the array of actuator bumps will contact the fixed actuator electrodes, thereby ensuring that the MEMS beam will be physically separated therefrom.

8. The MEMS structure of claim 1, wherein the array of actuator bumps are mini-bumps placed in holes, openings, or spaces inside a lower MEMS wire.

9. The MEMS structure of claim 1, wherein the array of actuator bumps extend from a lower electrode of the MEMS beam.

10. The MEMS structure of claim 9, wherein the array of actuator bumps are in alignment with isolated actuator electrodes.

11. The MEMS structure of claim 9, wherein the array of actuator bumps are in alignment with spacers between isolated actuator electrodes.

12. The MEMS structure of claim 1, wherein the array of actuator bumps are on an insulator material on the underside of the MEMS beam.

13. The MEMS structure of claim 1, wherein the underside of the MEMS beam comprises an insulator material.

14. The MEMS structure of claim 1, wherein the array of actuator bumps comprises:

a first subset of the array of actuator bumps in direct contact with and extending from the underside of the MEMS beam; and

a first subset of the array of actuator bumps in direct contact with and extending from the surface of the fixed actuator electrodes.