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Substrate-less stackable package with wire-bond interconnect

  • US 10,170,412 B2
  • Filed: 04/12/2018
  • Issued: 01/01/2019
  • Est. Priority Date: 05/22/2012
  • Status: Active Grant
First Claim
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1. An apparatus, comprising:

  • conductive elements of a conductive layer on a bottom side of a package;

    wire bond wires coupled to and extending from first upper surface portions of the conductive elements;

    a microelectronic element coupled to second upper surface portions of the conductive elements through conductive contact structures;

    a wire bond wire of the wire bond wires interconnected for electrical conductivity to a conductive contact structure of the conductive contact structures by a conductive element of the conductive elements for a redistribution on the bottom side of the package; and

    a dielectric layer contacting the wire bond wires and side portions of the microelectronic element to define at least one dimension of the package, the conductive layer at least partially defining the bottom side of the package.

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