Substrate-less stackable package with wire-bond interconnect
First Claim
1. An apparatus, comprising:
- conductive elements of a conductive layer on a bottom side of a package;
wire bond wires coupled to and extending from first upper surface portions of the conductive elements;
a microelectronic element coupled to second upper surface portions of the conductive elements through conductive contact structures;
a wire bond wire of the wire bond wires interconnected for electrical conductivity to a conductive contact structure of the conductive contact structures by a conductive element of the conductive elements for a redistribution on the bottom side of the package; and
a dielectric layer contacting the wire bond wires and side portions of the microelectronic element to define at least one dimension of the package, the conductive layer at least partially defining the bottom side of the package.
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Accused Products
Abstract
A method for making a microelectronic unit includes forming a plurality of wire bonds on a first surface in the form of a conductive bonding surface of a structure comprising a patternable metallic element. The wire bonds are formed having bases joined to the first surface and end surfaces remote from the first surface. The wire bonds have edge surfaces extending between the bases and the end surfaces. The method also includes forming a dielectric encapsulation layer over a portion of the first surface of the conductive layer and over portions of the wire bonds such that unencapsulated portions of the wire bonds are defined by end surfaces or portions of the edge surfaces that are unconvered by the encapsulation layer. The metallic element is patterned to form first conductive elements beneath the wire bonds and insulated from one another by portions of the encapsulation layer.
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Citations
20 Claims
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1. An apparatus, comprising:
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conductive elements of a conductive layer on a bottom side of a package; wire bond wires coupled to and extending from first upper surface portions of the conductive elements; a microelectronic element coupled to second upper surface portions of the conductive elements through conductive contact structures; a wire bond wire of the wire bond wires interconnected for electrical conductivity to a conductive contact structure of the conductive contact structures by a conductive element of the conductive elements for a redistribution on the bottom side of the package; and a dielectric layer contacting the wire bond wires and side portions of the microelectronic element to define at least one dimension of the package, the conductive layer at least partially defining the bottom side of the package. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification