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Light emitting device with buffer pads

  • US 10,170,455 B2
  • Filed: 07/25/2017
  • Issued: 01/01/2019
  • Est. Priority Date: 09/04/2015
  • Status: Active Grant
First Claim
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1. A light emitting device, comprising:

  • a carrier;

    a plurality of light emitting diode chips, disposed on the carrier, wherein each light emitting diode chip comprises;

    a first type semiconductor layer;

    an active layer, disposed on the first type semiconductor layer;

    a second type semiconductor layer, disposed on the active layer;

    a via hole, sequentially penetrating through the first type semiconductor layer, the active layer and a portion of the second type semiconductor layer, wherein the first type semiconductor layer, the active layer, the second type semiconductor layer and the via hole define an epitaxial structure; and

    a plurality of bonding pads, disposed between the epitaxial structure and a receiving substrate and comprising a first bonding pad electrically connected to the first type semiconductor layer and a second bonding pad electrically connected to the second type semiconductor layer; and

    a plurality of buffer pads, located on the carrier and disposed between the carrier and the second type semiconductor layers of the epitaxial structures, wherein the buffer pads are with Young'"'"'s modulus of 2˜

    10 GPa, the second bonding pad is disposed within the via hole to contact the second type semiconductor layer, and the epitaxial structures are electrically bonded to the receiving substrate through the bonding pads,wherein an area of an orthogonal projection of each of the buffer pads on the carrier is 0.6 times to 1.2 times of an area of an orthogonal projection of the epitaxial structure on the carrier.

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