Semiconductor device and method for manufacturing the same
First Claim
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1. A method for manufacturing a semiconductor device, comprising the steps of:
- forming an oxynitride semiconductor layer over an oxide insulating layer formed over an insulating surface;
forming a gate insulating layer over the oxynitride semiconductor layer; and
forming a gate electrode over the gate insulating layer,wherein the oxynitride semiconductor layer includes a channel region, a source region, and a drain region,wherein an amount of oxygen released by the oxide insulating layer in thermal desorption spectroscopy is greater than or equal to 1.0×
1020 atoms/cm3, andwherein the oxynitride semiconductor layer is an n-type semiconductor layer.
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Abstract
An object is to provide a semiconductor device including an oxynitride semiconductor whose carrier density is controlled. By introducing controlled nitrogen into an oxide semiconductor layer, a transistor in which an oxynitride semiconductor having desired carrier density and on characteristics is used for a channel can be manufactured. Further, with the use of the oxynitride semiconductor, even when a low resistance layer or the like is not provided between an oxynitride semiconductor layer and a source electrode and between the oxynitride semiconductor layer and a drain electrode, favorable contact characteristics can be exhibited.
148 Citations
14 Claims
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1. A method for manufacturing a semiconductor device, comprising the steps of:
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forming an oxynitride semiconductor layer over an oxide insulating layer formed over an insulating surface; forming a gate insulating layer over the oxynitride semiconductor layer; and forming a gate electrode over the gate insulating layer, wherein the oxynitride semiconductor layer includes a channel region, a source region, and a drain region, wherein an amount of oxygen released by the oxide insulating layer in thermal desorption spectroscopy is greater than or equal to 1.0×
1020 atoms/cm3, andwherein the oxynitride semiconductor layer is an n-type semiconductor layer. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method for manufacturing a semiconductor device, comprising the steps of:
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forming an oxynitride semiconductor layer over an oxide insulating layer formed over an insulating surface; forming a gate insulating layer over the oxynitride semiconductor layer; and forming a gate electrode over the gate insulating layer, wherein the oxynitride semiconductor layer includes a channel region, a source region, and a drain region, and wherein an amount of oxygen released by the oxide insulating layer in thermal desorption spectroscopy is greater than or equal to 1.0 ×
1020 atoms/cm3. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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Specification