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Process for transferring microstructures to a final substrate

  • US 10,173,405 B2
  • Filed: 08/17/2012
  • Issued: 01/08/2019
  • Est. Priority Date: 08/17/2012
  • Status: Active Grant
First Claim
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1. A transfer film for transferring microstructures to a final substrate, the transfer film comprising a carrier film having a planar surface on its side toward the microstructures, one or more fully cured binder layers on a surface of the carrier film, the microstructures, and one or more fully cured conformal release coating layers on a surface of the microstructures between the one or more fully cured binder layers and the microstructures, wherein the microstructures are single or multi-layer structures, each layer having one planar surface and an opposing surface that comprises:

  • voids in a substantially planar surface, the voids optionally filled or coated with another material;

    raised areas in a substantially planar surface;

    or combinations thereof, and wherein the one or more fully cured binder layers is strongly bonded to the carrier film and to the one or more fully cured conformal release coating layers on a surface of the microstructures.

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