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Microfabricated ultrasonic transducers and related apparatus and methods

  • US 10,175,206 B2
  • Filed: 08/29/2017
  • Issued: 01/08/2019
  • Est. Priority Date: 07/14/2014
  • Status: Active Grant
First Claim
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1. An ultrasound device, comprising:

  • a first substrate having a capacitive micromachined ultrasonic transducer (CMUT) flush with a top surface of the first substrate, the CMUT comprising a cavity and a silicon layer at least partially sealing the cavity;

    a node disposed on the silicon layer;

    a second substrate having an integrated circuit formed therein, the second substrate bonded to the first substrate;

    a bond pad disposed on the second substrate and electrically connected to the integrated circuit; and

    a conductive path disposed between the node and the bond pad, wherein the conductive path is external to the first and second substrates.

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