Cards and devices with embedded holograms

• US 10,176,423 B1
• Filed: 08/01/2017
• Issued: 01/08/2019
• Est. Priority Date: 01/23/2011
• Status: Active Grant

• Current Assignee: Dynamics Inc.
• Original Assignee: Dynamics Inc.
• Inventors: Mullen, Jeffrey D., Nicklaus, Eric R.
• Primary Examiner(s): Marshall, Christle I
• Application Number:
  US15/665,666
• Time in Patent Office: 525 Days
• Field of Search: None
• CPC Class Codes: B32B 2307/412 Transparent
• CPC Class Codes: B32B 2457/08 PCBs, i.e. printed circuit boards
• CPC Class Codes: B32B 27/08 of synthetic resin
• CPC Class Codes: B32B 3/08 characterised by added members at particular parts layer formed of separate pieces of material which are juxtaposed side-by-side B32B3/14, B32B3/18
• CPC Class Codes: G03H 1/0476 Holographic printer G03H1/268 takes precedence
• CPC Class Codes: G06K 15/12 by photographic printing , e.g. by laser printers
• CPC Class Codes: G06K 19/042 the record carrier having a form factor of a credit card and including a small sized disc, e.g. a CD or DVD disc shaped data carriers in general, see G11B20/00 and G11B23/00
• CPC Class Codes: G06K 19/06112 the marking being simulated using a light source, e.g. a barcode shown on a display or a laser beam with time-varying intensity profile
• CPC Class Codes: G06K 19/06206 the magnetic marking being emulated
• CPC Class Codes: G06K 19/0716 at least one of the integrated circuit chips comprising a sensor or an interface to a sensor
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/07709 the interface being a keyboard
• CPC Class Codes: G06K 19/16 the marking being a hologram or diffraction grating

Abstract

A card, such as a payment card, or other device may include an electronics package. The electronics package may include electronic components mounted on a flexible, printed circuit board. The electronics package may be laminated (e.g., via a hot, cold, or molding lamination process) between layers of transparent polymer. A hologram may be fixed to one side of the electronics package such that the hologram may be viewed from the exterior of the laminated card having transparent polymer layers. As such, the hologram may not be removed without breaching the integrity of a transparent polymer layer.

Claims

1. A method comprising:

applying an adhesive layer on a surface of a flexible printed circuit board; and

applying a hologram on the adhesive layer.

2. The method of claim 1, wherein an adhesive that forms the adhesive layer is applied using adhesive tape.

3. The method of claim 1, wherein an adhesive layer has a uniform thickness.

4. The method of claim 1, further comprising:

applying a layer of transparent polymer on the surface of the flexible circuit board and over the hologram.

5. The method of claim 1, further comprising:

applying a layer of transparent polymer on the surface of the flexible circuit board and over the hologram; and

applying a layer of print material over the layer of transparent polymer.

6. The method of claim 1, further comprising:

applying a layer of print material over the hologram; and

applying a layer of transparent polymer on the surface of the flexible circuit board and over the layer of print material.

7. The method of claim 1, wherein the hologram is a security hologram.

8. The method of claim 1, further comprising:

applying a layer of transparent polymer on the surface of the flexible circuit board and over the hologram to form a powered card.

9. The method of claim 1, further comprising:

applying a dynamic magnetic communication device to the surface of the flexible circuit board.