Thyristor and thermal switch device and assembly techniques therefor
First Claim
1. A hybrid device, comprising:
- a lead frame, the lead frame comprising;
a central portion; and
a side pad, the side pad being laterally disposed with respect to the central portion;
a thyristor device, the thyristor device comprising a semiconductor die and further comprising a gate, wherein the thyristor device is disposed on a first side of the lead frame on the central portion;
a positive temperature coefficient (PTC) device electrically coupled to the gate of the thyristor device, wherein the PTC device is disposed on the side pad on the first side of the lead frame, and is not disposed on the thyristor device; and
a thermal coupler having a first end connected to the thyristor device and a second end attached to the PTC device.
1 Assignment
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Accused Products
Abstract
A device may include a lead frame, where the lead frame includes a central portion, and a side pad, the side pad being laterally disposed with respect to the central portion. The device may further include a thyristor device, the thyristor device comprising a semiconductor die and further comprising a gate, wherein the thyristor device is disposed on a first side of the lead frame on the central portion. The device may also include a positive temperature coefficient (PTC) device electrically coupled to the gate of the thyristor device, wherein the PTC device is disposed on the side pad on the first side of the lead frame; and a thermal coupler having a first end connected to the thyristor device and a second end attached to the PTC device.
8 Citations
17 Claims
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1. A hybrid device, comprising:
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a lead frame, the lead frame comprising; a central portion; and a side pad, the side pad being laterally disposed with respect to the central portion; a thyristor device, the thyristor device comprising a semiconductor die and further comprising a gate, wherein the thyristor device is disposed on a first side of the lead frame on the central portion; a positive temperature coefficient (PTC) device electrically coupled to the gate of the thyristor device, wherein the PTC device is disposed on the side pad on the first side of the lead frame, and is not disposed on the thyristor device; and a thermal coupler having a first end connected to the thyristor device and a second end attached to the PTC device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method for forming a hybrid device, comprising:
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providing a lead frame, the lead frame comprising; a central portion; and a side pad, the side pad being laterally disposed with respect to the central portion; affixing a thyristor device to a first side of the central portion of the lead frame, the thyristor device comprising a semiconductor die and further comprising a gate; affixing a positive temperature coefficient (PTC) device to the side pad on the first side of the lead frame, wherein the PTC device is not disposed on the thyristor device; and connecting a first end of a thermal coupler to the thyristor device and a second end of the thermal coupler to the PTC device, wherein the gate of the thyristor device is electrically connected to the PTC device. - View Dependent Claims (12, 13, 14, 15, 16, 17)
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Specification