Tamper-proof electronic packages with stressed glass component substrate(s)
First Claim
1. A tamper-proof electronic package comprising:
- a glass substrate, the glass substrate comprising stressed glass with a compressively-stressed surface layer;
at least one electronic component secured to the glass substrate within a secure volume of the tamper-proof electronic package, the at least one electronic component comprising an electronic module;
an enclosure defining, at least in part, the secure volume;
a tamper-respondent detector monitoring for the attempted intrusion event into the secure volume;
a fragmenting trigger element secured to the glass substrate to trigger fragmentation of the glass substrate with the tamper-respondent detector detecting the attempted intrusion event into the secure volume;
wherein the enclosure comprises a plurality of stressed glass elements adhesively bonded together to form the enclosure, each stressed glass element comprising a respective, compressively-stressed surface layer, and the plurality of stressed glass elements defining multiple sides of the secure volume, and wherein one stressed glass element of the plurality of stressed glass elements comprises the glass substrate, and the at least one electronic component and the fragmentation trigger element are adhesively secured to the one stressed glass element andwherein the glass substrate fragments with an attempted intrusion event into the tamper-proof electronic package, the fragmenting of the glass substrate also fragmenting the at least one electronic component secured thereto, destroying the at least one electronic component.
1 Assignment
0 Petitions
Accused Products
Abstract
Tamper-proof electronic packages and fabrication methods are provided which include a glass substrate. The glass substrate is stressed glass with a compressively-stressed surface layer. Further, one or more electronic components are secured to the glass substrate within a secure volume of the tamper-proof electronic package. In operation, the glass substrate is configured to fragment with an attempted intrusion event into the electronic package, and the fragmenting of the glass substrate also fragments the electronic component(s) secured to the glass substrate, thereby destroying the electronic component(s). In certain implementations, the glass substrate has undergone ion-exchange processing to provide the stressed glass. Further, the electronic package may include an enclosure, and the glass substrate may be located within the secure volume separate from the enclosure, or alternatively, the enclosure may be a stressed glass enclosure, an inner surface of which is the glass substrate for the electronic component(s).
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Citations
7 Claims
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1. A tamper-proof electronic package comprising:
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a glass substrate, the glass substrate comprising stressed glass with a compressively-stressed surface layer; at least one electronic component secured to the glass substrate within a secure volume of the tamper-proof electronic package, the at least one electronic component comprising an electronic module; an enclosure defining, at least in part, the secure volume; a tamper-respondent detector monitoring for the attempted intrusion event into the secure volume; a fragmenting trigger element secured to the glass substrate to trigger fragmentation of the glass substrate with the tamper-respondent detector detecting the attempted intrusion event into the secure volume; wherein the enclosure comprises a plurality of stressed glass elements adhesively bonded together to form the enclosure, each stressed glass element comprising a respective, compressively-stressed surface layer, and the plurality of stressed glass elements defining multiple sides of the secure volume, and wherein one stressed glass element of the plurality of stressed glass elements comprises the glass substrate, and the at least one electronic component and the fragmentation trigger element are adhesively secured to the one stressed glass element and wherein the glass substrate fragments with an attempted intrusion event into the tamper-proof electronic package, the fragmenting of the glass substrate also fragmenting the at least one electronic component secured thereto, destroying the at least one electronic component. - View Dependent Claims (2, 3, 4, 5)
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6. A fabrication method comprising:
fabricating a tamper-proof electronic package, the fabricating comprising; providing a glass substrate, the glass substrate comprising stressed glass with a compressively-stressed surface layer; securing at least one electronic component to the glass substrate, and the glass substrate being within a secure volume of the tamper-proof electronic package, and the at least one electronic component comprising an electronic module; providing an enclosure defining, at least in part, the secure volume; providing a tamper-respondent detector monitoring for the attempted intrusion event into the secure volume; providing a fragmenting trigger element secured to the glass substrate to trigger fragmentation of the glass substrate with the tamper-responding detector detecting the attempted intrusion event into the secure volume; wherein the enclosure comprises a plurality of stressed glass elements adhesively bonded together to form the enclosure, each stressed glass element comprising a respective, compressively-stressed surface layer, and the plurality of stressed glass elements defining multiple sides of the secure volume, and wherein one stressed glass element of the plurality of stressed glass elements comprises the glass substrate, and the at least one electronic component and the fragmentation trigger element are adhesively secured to the one stressed glass element; and wherein the glass substrate fragments with an attempted intrusion event into the secure volume of the tamper-proof electronic package, the fragmenting of the glass substrate also fragmenting the at least one electronic component secured thereto, destroying the at least one electronic component. - View Dependent Claims (7)
Specification