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Tamper-proof electronic packages with stressed glass component substrate(s)

  • US 10,177,102 B2
  • Filed: 12/05/2017
  • Issued: 01/08/2019
  • Est. Priority Date: 05/13/2016
  • Status: Active Grant
First Claim
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1. A tamper-proof electronic package comprising:

  • a glass substrate, the glass substrate comprising stressed glass with a compressively-stressed surface layer;

    at least one electronic component secured to the glass substrate within a secure volume of the tamper-proof electronic package, the at least one electronic component comprising an electronic module;

    an enclosure defining, at least in part, the secure volume;

    a tamper-respondent detector monitoring for the attempted intrusion event into the secure volume;

    a fragmenting trigger element secured to the glass substrate to trigger fragmentation of the glass substrate with the tamper-respondent detector detecting the attempted intrusion event into the secure volume;

    wherein the enclosure comprises a plurality of stressed glass elements adhesively bonded together to form the enclosure, each stressed glass element comprising a respective, compressively-stressed surface layer, and the plurality of stressed glass elements defining multiple sides of the secure volume, and wherein one stressed glass element of the plurality of stressed glass elements comprises the glass substrate, and the at least one electronic component and the fragmentation trigger element are adhesively secured to the one stressed glass element andwherein the glass substrate fragments with an attempted intrusion event into the tamper-proof electronic package, the fragmenting of the glass substrate also fragmenting the at least one electronic component secured thereto, destroying the at least one electronic component.

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