Telecommunications device

• US 10,177,501 B2
• Filed: 02/15/2017
• Issued: 01/08/2019
• Est. Priority Date: 04/11/2006
• Status: Active Grant

• Current Assignee: CommScope Technologies, LLC (CommScope Holding Company, Inc.)
• Original Assignee: CommScope Technologies, LLC (CommScope Holding Company, Inc.)
• Inventors: Hammond, Jr., Bernard Harold, Murray, David Patrick, George, Ian Robert
• Primary Examiner(s): Vu, Hien
• Application Number:
  US15/433,399
• Publication Number:
  US 20170288349A1
• Time in Patent Office: 692 Days
• Field of Search: 439676, 439 761, 439941
• CPC Class Codes: H01R 13/6461 Means for preventing cross-talk
• CPC Class Codes: H01R 13/6466 on substrates, e.g. printed circuit boards [PCB]
• CPC Class Codes: H01R 13/6658 on printed circuit board H01R13/6666 - H01R13/6691 take precedence
• CPC Class Codes: H01R 13/719 specially adapted for high frequency, e.g. with filters
• CPC Class Codes: H01R 2107/00 Four or more poles
• CPC Class Codes: H01R 24/64 for high frequency, e.g. RJ 45
• CPC Class Codes: H01R 4/2416 the contact members having insulation-cutting edges, e.g. of tuning fork type
• CPC Class Codes: H05K 1/0228 Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors balanced signal pairs H05K1/0245
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 2201/09236 Parallel layout
• CPC Class Codes: H05K 2201/09245 Crossing layout
• CPC Class Codes: H05K 2201/09263 Meander
• CPC Class Codes: H05K 2201/10189 Non-printed connector
• CPC Class Codes: H05K 3/4644 by building the multilayer layer by layer, i.e. build-up multilayer circuits making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602
• CPC Class Codes: Y10S 439/941 Crosstalk suppression
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49204 Contact or terminal manufacturing
• CPC Class Codes: Y10T 29/49222 forming array of contacts or terminals

Abstract

The present disclosure relates to a telecommunications jack including a housing having a port for receiving a plug. The jack also includes a plurality of contact springs adapted to make electrical contact with the plug when the plug is inserted into the port of the housing, and a plurality of wire termination contacts for terminating wires to the jack. The jack further includes a circuit board that electrically connects the contact springs to the wire termination contacts. The circuit board includes a multi-zone crosstalk compensation arrangement for reducing crosstalk at the jack.

Claims

1. A telecommunications device comprising:

a housing defining a port for receiving a plug;

a plurality of contact springs adapted to make electrical contact with the plug when the plug is inserted into the port of the housing;

a plurality of wire termination contacts for terminating wires to the device;

a circuit board that electrically connects the contact springs to the wire termination contacts, the circuit board including first and second conductive layers separated by a dielectric layer, and a third conductive layer separated from the second conductive layer by a second dielectric layer, the second dielectric layer having a thickness that is at least 2.5 times the thickness of the first dielectric layer; and

the first and second conductive layers including a cross talk compensation arrangement including spaced-apart capacitor members, the capacitor members being separated by the first dielectric layer.

2. The telecommunications jack of claim 1, wherein the capacitor members comprise opposing plates.

3. The telecommunications jack of claim 2, wherein the opposing plates include a first capacitor plate and a second capacitor plate, wherein the first plate is larger than the second plate so that portions of the first plate extend outwardly beyond the boundaries of the second plate.

4. The telecommunications jack of claim 1, wherein the first and second dielectric layers have different dielectric constants.

5. The telecommunications jack of claim 1, wherein the second dielectric layer has a thickness that is at least 5 times the thickness of the first dielectric layer.

6. The telecommunications jack of claim 1, wherein the second dielectric layer is ten times thicker than the first dielectric layer, and wherein the thickness of the second dielectric layer is greater than 0.05 inches, whereby the thickness of the first dielectric layer is greater than 0.005 inches.

7. The telecommunications jack of claim 6, wherein the thickness of the second dielectric layer is less than 0.055 inches, whereby the thickness of the first dielectric layer is less than 0.0055 inches.

8. The telecommunications jack of claim 1, wherein the thickness of the first dielectric layer is less than 0.0055 inches.

9. The telecommunications jack of claim 8, wherein the second dielectric layer is ten times thicker than the first dielectric layer, whereby the thickness of the second dielectric layer is less than 0.055 inches.

10. The telecommunications jack of claim 1, wherein the thickness of the first dielectric layer is less than 0.0075 inches.

11. The telecommunications jack of claim 10, wherein the thickness of the first dielectric layer is less than 0.0050 inches.

12. A telecommunications jack having a plurality of wire pairs comprising:

a housing defining a port for receiving a plug;

a plurality of contact springs adapted to make electrical contact with the plug when the plug is inserted into the port of the housing;

a plurality of wire termination contacts for terminating wires to the jack;

a circuit board that electrically connects the contact springs to the wire termination contacts, the circuit board including first and second conductive layers separated by a first dielectric layer, the first dielectric layer having a thickness less than about 0.005 inches; and

the first and second conductive layers including a crosstalk compensation arrangement including spaced-apart capacitor members, the capacitor members being separated by the first dielectric layer;

wherein the circuit board further including a third conductive layer separated from the second conductive layer by a second dielectric layer.

13. The telecommunications jack of claim 12, wherein the first dielectric layer has a thickness in the range of 0.001 inches to 0.005 inches.

14. The telecommunications jack of claim 12, the second dielectric layer having a thickness that is at least 2.5 times the thickness of the first dielectric layer.

15. The telecommunications jack of claim 14, wherein the second dielectric layer has a thickness that is at least 5 times the thickness of the first dielectric layer.

16. The telecommunications jack of claim 14, wherein the first and second dielectric layers have different dielectric constants.

17. The telecommunications jack of claim 14, wherein one or more of the first, second and third conductive layers includes a return loss arrangement including a capacitive coupling between wires of at least one wire pair.

18. The telecommunications jack of claim 17, wherein the capacitive coupling between wires of the at least one wire pair is adjacent the wire termination contacts.

19. A telecommunications jack comprising:

a housing defining a port for receiving a plug;

a plurality of contact springs adapted to make electrical contact with the plug when the plug is inserted into the port of the housing;

a plurality of wire termination contacts for terminating wires to the jack;

a circuit board that electrically connects the contact springs to the wire termination contacts, the circuit board including first and second conductive layers separated by a first dielectric layer, the first dielectric layer having a thickness less than 0.0075 inches, wherein circuit board includes a first side and an opposite second side,

wherein the plurality of contact springs extend from the first side of the circuit board and the plurality of wire termination contacts extend from the second side of the circuit board; and

the first and second conductive layers including a cross talk compensation arrangement including spaced-apart capacitor members, the capacitor members being separated by the first dielectric layer; and

wherein the circuit board further including a third conductive layer separated from the second conductive layer by a second dielectric layer.

20. The telecommunications jack of claim 19, wherein the second dielectric layer having a thickness that is at least 2.5 times the thickness of the first dielectric layer.

21. A telecommunications jack having a plurality of wire pairs comprising:

a housing defining a port fir receiving a plug;

a plurality of contact springs adapted to make electrical contact with the plug when the plug is inserted into the port of the housing;

a plurality of wire termination contacts for terminating wires to the jack;

a circuit board that electrically connects the contact springs to the wire termination contacts, the circuit board including a plurality of conductive tracks that electrically connect the plurality of contact springs to the plurality of wire termination contacts, the plurality of conductive tracks including a plurality of vias including a first set of vias receiving the plurality of contact springs and a second set of vias receiving the plurality of wire termination contacts;

a capacitive element electrically connected to two of the conductive tracks on the circuit board, the capacitive element including a first plate and a second plate;

a first extension trace that electrically connects the first plate to a first via of the plurality of vias;

a second extension trace that electrically connects the second plate to a second via of the plurality of vias; and

wherein at least a portion of at least one of the first and second extension traces includes at least four parallel and side-by-side sections each section joined to at least one of the other sections by a semicircular turn in the at least one of the first and second extension traces.

22. The telecommunications jack of claim 21, wherein each of the first and second vias is included in the second set of vias.

23. The telecommunications jack of claim 21, the circuit board including first and second conductive layers separated by a first dielectric layer, and a third conductive layer separated from the second conductive layer by a second dielectric layer, wherein the first and second dielectric layers have different thicknesses.

24. The telecommunications jack of claim 23, wherein the first dielectric layer has a thickness less than 0.0075 inches.

25. The telecommunications jack of claim 23, wherein the first plate is on the first conductive layer and the second plate is on the second layer, and the first and second capacitive plates are separated by the first dielectric layer.

26. The telecommunications jack of claim 23, wherein the capacitive element is a first capacitive element, and further including:

a second capacitive element electrically connected to two of the conductive tracks on the circuit board different from the conductive tracks electrically connected to the first capacitive element, the second capacitive element including a third plate and a fourth plate;

a third extension trace that electrically connects the third plate to a third via of the plurality of vias;

a fourth extension trace that electrically connects the forth plate to a fourth via of the plurality of vias; and

wherein at least a portion of at least one of the third and fourth extension traces includes at least four parallel and side-by-side sections each section joined to at least one of the other sections by a semicircular turn in the at least one of the third and fourth extension traces.

27. The telecommunications jack of claim 23, wherein the capacitive element is a capacitor electrically connected to conductive tracks for wires of the same wire pair.

28. A telecommunications jack having a plurality of wire pairs comprising:

a housing defining a port for receiving a plug;

a plurality of contact springs adapted to make electrical contact with the plug when the plug is inserted into the port of the housing;

a plurality of wire termination contacts for terminating wires to the jack;

a circuit board including a plurality of conductive tracks that connect the plurality of contact springs and the plurality of wire termination contacts;

a capacitive element electrically connected to a first conductive track of the plurality of conductive tracks and a second conductive track of the plurality of conductive tracks, the capacitive element including a first plate and a second plate;

a first extension trace that electrically connects the first plate to the first conductive track;

a second extension trace that electrically connects the second plate to the second conductive track; and

wherein at least a portion of at least one of the first and second extension traces includes at least four side-by-side sections joined by turns in the at least one extension trace.

29. The telecommunications jack of claim 28, wherein the four side-by-side sections are parallel.

30. The telecommunications jack of claim 28, wherein the turns joining the side-by-side sections are semicircular.

31. The telecommunications jack of claim 30, the circuit board including first and second conductive layers separated by a first dielectric layer, and a third conductive layer separated from the second conductive layer by a second dielectric layer, wherein the first and second dielectric layers have different thicknesses, and wherein the first dielectric layer has a thickness less than 0.0075 inches.

32. The telecommunications jack of claim 31, wherein the first dielectric layer has a thickness less than 0.005 inches.

33. The telecommunications jack of claim 30, wherein the capacitive element is a first capacitive element, and further including:

a second capacitive element electrically connected to a third conductive track of the plurality of conductive tracks and a fourth conductive track of the plurality of conductive tracks, the second capacitive element including a third plate and a fourth plate;

a third extension trace that electrically connects the third plate to a third conductive track;

a fourth extension trace that electrically connects the forth plate to a fourth conductive track; and

wherein at least a portion of at least one of the third and fourth extension traces includes at least four side-by-side sections joined by semicircular turns in the at least one extension trace.

34. The telecommunications jack of claim 33, wherein each of the first and second capacitive elements is a return loss capacitor electrically connected between conductive tracks of the same wire pair.