Circuit board module and electronic device

• US 10,178,754 B2
• Filed: 04/25/2018
• Issued: 01/08/2019
• Est. Priority Date: 04/25/2017
• Status: Active Grant

• Current Assignee: Omron Corporation
• Original Assignee: Omron Automotive Electronics Company Limited (Nidec Corporation)
• Inventors: Kobayashi, Ryo, Kobayashi, Tomoyoshi
• Primary Examiner(s): Haughton, Anthony M
• Application Number:
  US15/962,207
• Publication Number:
  US 20180310396A1
• Time in Patent Office: 258 Days
• Field of Search: 361715, 361717, 361718, 361719, 361721, 361720
• CPC Class Codes: H05K 1/0204 using means for thermal conduction connection in the thickness direction of the substrate H05K1/0207 takes precedence
• CPC Class Codes: H05K 1/0206 by printed thermal vias
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 1/184 Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
• CPC Class Codes: H05K 2201/066 Heatsink mounted on the surface of the printed circuit board [PCB]
• CPC Class Codes: H05K 2201/1003 Non-printed inductor
• CPC Class Codes: H05K 2201/10166 Transistor
• CPC Class Codes: H05K 2201/10416 Metallic blocks or heatsinks completely inserted in a PCB
• CPC Class Codes: H05K 2201/10545 Related components mounted on both sides of the PCB
• CPC Class Codes: H05K 2201/10628 Leaded surface mounted device
• CPC Class Codes: H05K 7/20154 Heat dissipaters coupled to components
• CPC Class Codes: H05K 7/20409 Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
• CPC Class Codes: H05K 7/20445 the coupling element being an additional piece, e.g. thermal standoff
• CPC Class Codes: H05K 7/20918 the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels

Abstract

A circuit board module includes: a first electronic component of a surface mounting type; a second electronic component of an insertion mounting type including a lead terminal; a circuit board; and a heat transfer body provided in the circuit board. The first electronic component is mounted on a front surface of the circuit board so as to overlap the heat transfer body in a board thickness direction. The heat transfer body is provided so as to transfer heat generated in the first electronic component to a back surface side of the circuit board. The second electronic component is mounted on a back surface of the circuit board. The second electronic component and the heat transfer body are thermally connected to a heat radiation body provided on the back surface side of the circuit board.

Claims

1. A circuit board module comprising:

a first electronic component of a surface mounting type;

a second electronic component of an insertion mounting type comprising a lead terminal;

a circuit board which has a penetrating hole into which the lead terminal is inserted, and on which the first electronic component and the second electronic component are mounted; and

a heat transfer body provided in the circuit board,

wherein the first electronic component is mounted on a front surface of the circuit board so as to overlap the heat transfer body in a board thickness direction of the circuit board,

wherein the heat transfer body is provided so as to transfer heat generated in the first electronic component to a back surface side of the circuit board,

wherein the second electronic component is mounted on a back surface of the circuit board by inserting the lead terminal into the penetrating hole from the back surface side of the circuit board, and

wherein the second electronic component and the heat transfer body are thermally connected to a heat radiation body provided on the back surface side of the circuit board.

2. The circuit board module according to claim 1,

wherein the heat transfer body comprises a metal core buried in the circuit board and is thermally connected to the first electronic component on the front surface side of the circuit board.

3. The circuit board module according to claim 1,

wherein the penetrating hole has a through hole provided at a position apart from the heat transfer body of the circuit board, and

wherein the lead terminal of the second electronic component is electrically connected to the circuit board in a state of being inserted into the through hole.

4. An electronic device comprising:

the circuit board module according to claim 1; and

the heat radiation body provided on the back surface side of the circuit board.

5. The electronic device according to claim 4,

wherein the heat radiation body comprises:

a projected thermal connection portion which protrudes toward the circuit board and is thermally connected to the heat transfer body; and

a recessed thermal connection portion which is recessed apart from the circuit board, into which a main body portion of the second electronic component is fitted, and which is thermally connected to the main body portion.

6. The electronic device according to claim 4, further comprising:

a case which houses the circuit board, the first electronic component, the second electronic component, and the heat transfer body; and

a cooler that is installed on the case and cools the heat radiation body,

wherein the heat radiation body comprises a heat sink comprising a heat radiation fin, and is provided on the case so as to be disposed on the back surface side of the circuit board.