Stacked power module with integrated thermal management
First Claim
1. A power module comprises:
- a stack of power electronic components arranged in layers;
an electrically conductive material separating each layer from one another;
a heat sink operatively connected to multiple sides of each power electronic component in said stack; and
a cooling path integrated with each layer in said stack,wherein said cooling path accommodates a cooling fluid or a solid to liquid phase change material.
1 Assignment
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Accused Products
Abstract
A power module including a plurality of power die layers including power electronic components; a plurality of heat sink components operatively connected to multiple sides of each power electronic component; a plurality of electrically conductive layers contacting the plurality of heat sink components, wherein a power die layer and an electrically conductive layer sequentially alternate to form a stacked structure such that both ends of the stacked structure includes an end electrically conductive layer. A cooling path is integrated with each layer in the stacked structure. A housing unit houses the stacked structure. The power electronic components may include heat-producing electronic devices. The cooling path may accommodate any of a fluid and solid to liquid phase change materials. The fluid comes into direct contact with the power die layers, heat sink components, and electrically conductive layers.
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Citations
19 Claims
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1. A power module comprises:
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a stack of power electronic components arranged in layers; an electrically conductive material separating each layer from one another; a heat sink operatively connected to multiple sides of each power electronic component in said stack; and a cooling path integrated with each layer in said stack, wherein said cooling path accommodates a cooling fluid or a solid to liquid phase change material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A power module comprising:
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a plurality of power die layers comprising power electronic components; a plurality of heat sink components operatively connected to multiple sides of each power electronic component; a plurality of electrically conductive layers contacting said plurality of heat sink components, wherein a power die layer and an electrically conductive layer sequentially alternate to form a stacked structure such that both ends of said stacked structure comprises an end electrically conductive layer; a cooling path integrated with each layer in said stacked structure; and a housing unit that houses said stacked structure, wherein said housing unit comprises a plurality of holes aligned with said cooling path to create an inlet and outlet for a cooling fluid to traverse along said cooling path. - View Dependent Claims (17, 18, 19)
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Specification