LED lamp with sensors disposed along the heatsink for managing luminous intensity, uniformity and temperature

• US 10,180,249 B2
• Filed: 03/23/2018
• Issued: 01/15/2019
• Est. Priority Date: 09/02/2015
• Status: Active Grant

• Current Assignee: ProPhotonix Limited
• Original Assignee: ProPhotonix Limited
• Inventors: Murphy, Karol, Panek, Peter
• Primary Examiner(s): Green, Tracie Y
• Application Number:
  US15/934,100
• Publication Number:
  US 20180209634A1
• Time in Patent Office: 298 Days
• CPC Class Codes: F21V 17/101 permanently, e.g. welding, gluing or riveting
• CPC Class Codes: F21V 17/107 using hinge joints
• CPC Class Codes: F21V 23/005 the substrate is supporting also the light source
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21Y 2113/13 comprising an assembly of point-like light sources
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: G01J 1/0407 Optical elements not provided otherwise, e.g. manifolds, windows, holograms, gratings
• CPC Class Codes: G01J 1/0422 using light concentrators, collectors or condensers
• CPC Class Codes: G01J 2001/4252 for testing LED's
• CPC Class Codes: G02B 6/0096 the lights guides being of the hollow type

Abstract

A novel LED lamp comprising: a lamp body; an LED mounted to the lamp body; an outer (exit) window; and a hinged clamp for releasably mounting the outer (exit) window to the lamp body such that light emitted from the LED passes through the outer (exit) window.

Claims

1. A novel LED lamp comprising:

a lamp body comprising a heat sink having a front surface, a rear surface and a side surface extending between the front surface and the rear surface;

an LED assembly mounted to the front surface of the heat sink, the LED assembly comprising a substrate and a plurality of LEDs mounted to the substrate; and

a sensor assembly mounted to the LED assembly and extending from the front surface of the heat sink alongside the side surface of the heat sink, the sensor assembly comprising a flexible polyimide substrate and a plurality of sensing elements mounted to the flexible polyimide substrate.

2. A novel LED lamp according to claim 1 wherein the heat sink further comprises a plurality of heat-dissipating elements extending from the rear surface of the heat sink.

3. A novel LED lamp according to claim 2 further comprising a driver circuit for driving the plurality of LEDs, the flexible polyimide substrate extending between the driver circuit and the LED assembly without interrupting air flow to the plurality of heat-dissipating elements extending from the rear surface of the heat sink.