Chip package, a chip package system, a method of manufacturing a chip package, and a method of operating a chip package
First Claim
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1. A chip package comprising:
- a first sensor configured to measure a magnetic field component up to a maximum magnetic field value;
a second sensor configured to measure the magnetic field component beyond the maximum magnetic field value; and
a circuit coupled to the first sensor and the second sensor and configured to receive at least one sensor signal from at least one of the first sensor and the second sensor,wherein the circuit is further configured to select the first sensor or the second sensor to measure the magnetic field component based on the received at least one sensor signal.
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Abstract
A chip package, a chip package system, a method of manufacturing a chip package, and a method of operating a chip package including: a first sensor configured to measure a magnetic field component up to a maximum magnetic field value; a second sensor configured to measure the magnetic field component beyond the maximum magnetic field value; and a circuit coupled to the first sensor and the second sensor and configured to receive at least one sensor signal from at least one of the first sensor and the second sensor, wherein the circuit is further configured to select the first sensor or the second sensor to measure the magnetic field component based on the received sensor signal.
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Citations
20 Claims
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1. A chip package comprising:
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a first sensor configured to measure a magnetic field component up to a maximum magnetic field value; a second sensor configured to measure the magnetic field component beyond the maximum magnetic field value; and a circuit coupled to the first sensor and the second sensor and configured to receive at least one sensor signal from at least one of the first sensor and the second sensor, wherein the circuit is further configured to select the first sensor or the second sensor to measure the magnetic field component based on the received at least one sensor signal. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A chip package comprising:
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a first sensor configured to provide a first signal representing a magnitude of a magnetic field within a first value range; a second sensor configured to provide a second signal representing the magnitude of the magnetic field within a second value range; wherein the second value range at least partially extends beyond a maximum value of the first value range; and a circuit coupled to the first sensor and the second sensor and configured to receive the first signal and the second signal, wherein the circuit is further configured to output at least one of the first signal and the second signal when the magnitude of the magnetic field is within the first value range and to output the second signal when the magnitude of the magnetic field is within the second value range.
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14. A chip package system comprising:
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a substrate comprising an electrically conductive element; a chip package attached to the substrate, the chip package comprising; a first sensor arranged a first distance from the electrically conductive element configured to measure a magnetic field component up to a maximum magnetic field value; a second sensor arranged a second distance from the electrically conductive element configured to measure the magnetic field component beyond the maximum magnetic field value; wherein the second distance is greater than the first distance; and a circuit coupled to the first sensor and the second sensor and configured to receive at least one sensor signal from at least one of the first sensor and the second sensor, wherein the circuit is further configured to select the first sensor or the second sensor to measure the magnetic field component based on the received sensor signal. - View Dependent Claims (15, 16, 17, 18)
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19. A method of manufacturing a chip package comprising:
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attaching a first sensor to a carrier, wherein the first sensor is configured to measure a magnetic field component up to a maximum magnetic field value; attaching a second sensor to the carrier, wherein the second sensor is configured to measure the magnetic field component beyond the maximum magnetic field value; and coupling a circuit to the first sensor and the second sensor and configured to receive at least one sensor signal from at least one of the first sensor and the second sensor, wherein the circuit is further configured to select the first sensor or the second sensor to measure the magnetic field component based on the received sensor signal.
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20. A method of operating a first sensor and a second sensor of a chip package, the chip package comprising:
- a first sensor configured to measure a magnetic field component up to a maximum magnetic field value and a second sensor configured to measure the magnetic field component beyond the maximum magnetic field value, the method comprising;
receiving at least one sensor signal from at least one of the first sensor and the second sensor; and selecting the first sensor or the second sensor to measure the magnetic field component based on the received sensor signal.
- a first sensor configured to measure a magnetic field component up to a maximum magnetic field value and a second sensor configured to measure the magnetic field component beyond the maximum magnetic field value, the method comprising;
Specification