Display tile structure and tiled display

• US 10,181,507 B2
• Filed: 07/07/2017
• Issued: 01/15/2019
• Est. Priority Date: 09/25/2014
• Status: Active Grant

• Current Assignee: X Display Company Technology Limited (Sensinnovat BVBA)
• Original Assignee: X-Celeprint Limited
• Inventors: Bower, Christopher, Meitl, Matthew, Cok, Ronald S.
• Primary Examiner(s): Alam, Mohammed R
• Application Number:
  US15/644,570
• Publication Number:
  US 20170309698A1
• Time in Patent Office: 557 Days
• CPC Class Codes: G06F 2203/04104 Multi-touch detection in digitiser, i.e. details about the simultaneous detection of a plurality of touching locations, e.g. multiple fingers or pen and finger
• CPC Class Codes: G06F 3/0412 Digitisers structurally integrated in a display
• CPC Class Codes: G06F 3/04164 Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
• CPC Class Codes: G06F 3/04166 Details of scanning methods, e.g. sampling time, grouping of sub areas or time sharing with display driving Synchronisation with the driving of the display or the backlighting unit to avoid interferences generated internally G06F3/04184
• CPC Class Codes: G06F 3/042 by opto-electronic means
• CPC Class Codes: G06F 3/044 by capacitive means
• CPC Class Codes: H01L 2224/18 High density interconnect [HDI] connectors; Manufacturing methods related thereto
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 27/156 two-dimensional arrays
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 2933/0075 relating to heat extraction or cooling elements
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements
• CPC Class Codes: H10K 50/87 Arrangements for heating or cooling
• CPC Class Codes: H10K 59/1201 Manufacture or treatment
• CPC Class Codes: H10K 59/131 Interconnections, e.g. wiring lines or terminals
• CPC Class Codes: H10K 59/179 Interconnections, e.g. wiring lines or terminals
• CPC Class Codes: H10K 59/18 Tiled displays
• CPC Class Codes: H10K 59/90 Assemblies of multiple devices comprising at least one organic light-emitting element
• CPC Class Codes: H10K 71/00 : Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: H10K 71/80 : using temporary substrates

Abstract

A display tile structure includes a tile layer with opposing emitter and backplane sides. A light emitter having first and second electrodes for conducting electrical current to cause the light emitter to emit light is disposed in the tile layer. First and second electrically conductive tile micro-wires and first and second conductive tile contact pads are electrically connected to the first and second tile micro-wires, respectively. The light emitter includes a plurality of semiconductor layers and the first and second electrodes are disposed on a common side of the semiconductor layers opposite the emitter side of the tile layer. The first and second tile micro-wires and first and second tile contact pads are disposed on the backplane side of the tile layer.

Claims

1. A method of making a display tile, comprising:

providing a tile substrate having a structure side;

disposing one or more light-emitting diodes (LEDs) on and in direct contact with the structure side of the tile substrate, each LED having a light-emitting side adjacent to the structure side to emit light through the tile substrate and an opposed connection side with first and second electrodes for providing electrical power to the LED to cause the LED to emit light;

forming a tile layer on or over the one or more LEDs and structure side of the tile substrate and exposing the first and second electrodes, the tile layer having an emitter side adjacent to the structure side of the tile substrate and a backplane side opposite the emitter side, the tile layer including a layer of light-absorbing material disposed in the tile layer on and in direct contact with the tile substrate and only partially encapsulating the one or more LEDs;

forming an electrically conductive first tile micro-wire electrically connected to the first electrode and an electrically conductive second tile micro-wire electrically connected to the second electrode, the first and second tile micro-wires disposed only on a side of the layer of light-absorbing material opposite the tile substrate and the first and second tile micro-wires not extending to the edges of the tile substrate; and

forming an exposed conductive first tile contact pad electrically connected to the first tile micro-wire and an exposed conductive second tile contact pad electrically connected to the second tile micro-wire, wherein the one or more LEDs comprise a plurality of semiconductor layers and the first and second electrodes are disposed on a common side of the plurality of semiconductor layers opposite the emitter side of the tile layer and wherein the first and second tile micro-wires and first and second tile contact pads are disposed only on a side of the layer of light-absorbing material opposite the tile substrate on the backplane side of the tile layer, and the first and second tile contact pads disposed on a portion of the first and second tile micro-wires that are in contact with the layer of light-absorbing material.

2. The method of claim 1, comprising:

providing a backplane having backplane contact pads on a backplane surface of the backplane;

disposing the backplane side of the tile layer adjacent to the backplane surface so that the backplane contact pads are in correspondence with the first tile and second tile contact pads; and

electrically connecting the tile contact pads to the backplane contact pads with electrical connectors.

3. The method of claim 2, comprising forming a tile heat-transfer structure on the tile layer, forming a backplane heat-transfer structure on the backplane, and thermally connecting the tile heat-transfer structure to the backplane heat-transfer structure.

4. The method of claim 2, comprising providing a plurality of display tiles electrically connected to the backplane to form a display.

5. The method of claim 2, comprising removing the tile substrate from the emitter side of the tile layer and from the one or more LEDs.

6. The method of claim 1, comprising providing a plurality of LEDs and cutting the tile layer into portions that each comprise respective one or more LEDs, respective first and second tile micro-wires, and respective first and second tile contact pads.

7. The method of claim 1, comprising forming the tile layer of a curable material, curing the curable material, and forming vias through at least a portion of the cured material to expose the first and second electrodes.

8. The method of claim 7, wherein the cured material is light absorbing, is a black matrix, comprises light-absorbing dyes, comprises light-absorbing pigments, or is black.

9. The method of claim 1, comprising disposing active or passive electrical components on or over the tile layer and electrically connecting the active or passive electrical components to the first and second tile micro-wires, the first and second tile contact pads, or the first and second electrodes.

10. The method of claim 1, comprising providing one or more active electrical components mounted on to the backplane side of the tile layer on a side of the layer of light-absorbing material opposite the tile substrate and electrically connected to the first or second tile micro-wires, electrodes, or tile contact pads and wherein at least one of the first or second tile micro-wires is electrically connected to the first tile contact pad or the second tile contact pad through one or more of the active electrical components.

11. The method of claim 10, wherein the active electrical components are transistors, integrated circuits, power supplies, or power-conversion circuits.

12. The method of claim 10, wherein at least one of the active electrical components is a driver that drives one or more of the LEDs.

13. The method of claim 1, comprising providing redundant red-light, green-light, and blue-light emitters arranged to emit light from the emitter side, the redundant red, green, and blue-light emitters each having respective first and second electrodes electrically connected to the first and second tile micro-wires, respectively.

14. The method of claim 1, wherein the one or more LEDs include a red-light emitter that emits red light, a green-light emitter that emits green light, and a blue-light emitter that emits blue light, each light emitter having the first and second electrodes electrically connected to the first and second tile micro-wires, respectively.

15. The method of claim 14, wherein the red, green, and blue light emitters form a full-color pixel in a display.

16. The method of claim 1, wherein the tile layer is a black matrix, comprises light-absorbing dyes, color-conversion materials, phosphors, single-crystal fluorophores, or nanocrystals, or comprises light-absorbing pigments, or is black.

17. The method of claim 1, comprising providing a transparent cover affixed to or coated on the emitter side of the tile layer.

18. The method of claim 1, wherein disposing the one or more LEDs on and in direct contact with the structure side of the tile substrate comprises micro-transfer printing the one or more LEDs onto the structure side of the tile substrate.

19. The method of claim 18, comprising providing the layer of light-absorbing material disposed in the tile layer on and in direct contact with the tile substrate and only partially encapsulating the one or more LEDs after micro-transfer printing the one or more LEDs.

20. The method of claim 18, comprising forming the first and second electrodes or first and second tile micro-wires after providing the layer of light-absorbing material.