System and method for manufacturing photovoltaic structures with a metal seed layer
First Claim
1. A method for fabricating a photovoltaic structure, the method comprising:
- depositing, inside a physical vapor deposition chamber, a transparent conductive oxide layer on an emitter layer of the photovoltaic structure;
depositing, within the same physical vapor deposition chamber and without requiring the photovoltaic structure to be removed from the physical vapor deposition chamber after deposition of the transparent conductive oxide layer, a metallic seed layer on the transparent conductive oxide layer;
depositing, using a plating technique, a metallic grid on the metallic seed layer; and
simultaneously annealing the transparent conductive oxide layer the metallic grid, and the metallic seed layer.
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Abstract
One embodiment of the present invention can provide a system for fabrication of a photovoltaic structure. The system can include a physical vapor deposition tool configured to sequentially deposit a transparent conductive oxide layer and a metallic layer on an emitter layer formed in a first surface of a Si substrate, without requiring the Si substrate to be removed from the physical vapor deposition tool after depositing the transparent conductive oxide layer. The system can further include an electroplating tool configured to plate a metallic grid on the metallic layer and a thermal annealing tool configured to anneal the transparent conductive oxide layer.
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9 Claims
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1. A method for fabricating a photovoltaic structure, the method comprising:
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depositing, inside a physical vapor deposition chamber, a transparent conductive oxide layer on an emitter layer of the photovoltaic structure; depositing, within the same physical vapor deposition chamber and without requiring the photovoltaic structure to be removed from the physical vapor deposition chamber after deposition of the transparent conductive oxide layer, a metallic seed layer on the transparent conductive oxide layer; depositing, using a plating technique, a metallic grid on the metallic seed layer; and simultaneously annealing the transparent conductive oxide layer the metallic grid, and the metallic seed layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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Specification