Protective window for an infrared sensor array

• US 10,182,195 B2
• Filed: 09/11/2015
• Issued: 01/15/2019
• Est. Priority Date: 09/23/2014
• Status: Active Grant

• Current Assignee: Teledyne FLIR LLC (Teledyne Technologies Incorporated)
• Original Assignee: FLIR Systems, Inc. (Teledyne Technologies Incorporated)
• Inventors: Kostrzewa, Joseph, Covington, Bruce, Posch, Chris
• Primary Examiner(s): Taningco, Marcus
• Application Number:
  US14/852,313
• Publication Number:
  US 20160088240A1
• Time in Patent Office: 1,222 Days
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
• CPC Class Codes: H04N 5/33 Transforming infrared radiation cameras or camera modules for generating image signals from infrared radiation H04N23/20; circuitry of SSIS for transforming infrared radiation into image signals H04N25/20

Abstract

Various embodiments of the present disclosure may include a focal plane array configured to capture thermal image data from a scene. The embodiments may further include a sensor window displaced a first distance from the focal plane array. The embodiments may also include a protective window displaced a second distance greater than the first distance from the focal plane array, wherein the second distance causes damage or debris incident on the protective window to be out of focus in the thermal image data.

Claims

1. A device for an infrared camera comprising:

a vacuum packaged assembly comprising a focal plane array configured to capture thermal image data from a scene and a sensor window configured to seal an evacuated area of the vacuum packaged assembly, wherein the sensor window is displaced a first distance from the focal plane array;

a protective window disposed adjacent to and in close proximity to the sensor window and displaced a second distance greater than the first distance from the focal plane array, wherein the second distance is predetermined such that damage or debris incident on the protective window is out of focus to the focal plane array, and wherein the protective window is disposed between the sensor window and any optics to be coupled to the infrared camera that incorporates the device; and

a frame for the device configured to form a package comprising the protective window directly connected to the vacuum packaged assembly.

2. The device of claim 1, wherein the protective window prevents image artifacts in the thermal image data resulting from environmental factors disposed on the protective window, and wherein the protective window does not produce optical characteristics in the thermal image data during use of the device.

3. The device of claim 1, wherein the device further comprises:

an alignment pin on the frame, wherein the alignment pin is configured to align the frame with the optics provided by the infrared camera connected with the device.

4. The device of claim 1, further comprising:

a sealing mechanism for the frame and configured to join together the focal plane array, the sensor window, and the protective window, wherein the sealing mechanism prevents damage and debris collection on the sensor window.

5. The device of claim 1, further comprising:

a printed circuit board assembly attachable to the focal plane array and configured to process the thermal image data.

6. The device of claim 5, further comprising:

a first spacer between the focal plane array and the printed circuit board assembly.

7. The device of claim 6, further comprising:

a second spacer connected to the printed circuit board assembly and configured to connect to additional image processing electronics.

8. The device of claim 7, wherein the infrared camera further comprises the additional image processing electronics configured to record the thermal image data and connected to the printed circuit board assembly.

9. The device of claim 1, wherein the second distance comprises a distance from the protective window to the sensor window greater than or equal to approximately 0.005 inches and less than or equal to approximately 0.100 inches.

10. The device of claim 1, wherein the package for the device comprises a removable portion of the infrared camera.

11. A method of operating the device of claim 1, the method comprising:

capturing the thermal image data from the scene using the device.

19. The method of claim 11, wherein the second distance comprises a distance from the protective window to the sensor window greater than or equal to approximately 0.005 inches and less than or equal to approximately 0.100 inches.

12. A method for providing a device for an infrared camera comprising:

providing a vacuum packaged assembly comprising a focal plane array configured to capture thermal image data from a scene and a sensor window configured to seal an evacuated area of the vacuum packaged assembly, wherein the sensor window is displaced at a first distance from the focal plane array;

providing a protective window disposed adjacent to and in close proximity to the sensor window and displaced a second distance greater than the first distance from the focal plane array, wherein the second distance is predetermined such that damage or debris incident on the protective window is out of focus to the focal plane array, and wherein the protective window is disposed between the sensor window and any optics to be coupled to the infrared camera that incorporates the device; and

providing a frame for the device configured to form a package comprising the protective window directly connected to the vacuum packaged assembly.

13. The method of claim 12, wherein the protective window prevents image artifacts in the thermal image data resulting from environmental factors disposed on the protective window, and wherein the protective window does not produce optical characteristics in the thermal image data during use of the device.

14. The method of claim 12, further comprising:

providing an alignment pin on the frame configured to align the frame with the optics provided by the infrared camera connected with the device.

15. The method of claim 14, further comprising:

sealing the focal plane array, the sensor window, and the protective window together using a sealing mechanism for the frame, wherein the sealing mechanism prevents damage and debris collection on the sensor window.

16. The method of claim 12, further comprising:

providing a printed circuit board assembly that is detachable from the focal plane array, wherein the printed circuit board assembly is configured to process the thermal image data.

17. The method of claim 16, further comprising:

providing a first spacer between the focal plane array and the printed circuit board assembly.

18. The method of claim 17, further comprising:

providing a second spacer to the printed circuit board assembly, wherein the second spacer is configured to connect to additional image processing electronics.