Mass transfer tool

• US 10,183,401 B2
• Filed: 09/30/2016
• Issued: 01/22/2019
• Est. Priority Date: 09/07/2012
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Higginson, John A., Bibl, Andreas, Albertalli, David
• Primary Examiner(s): Leja, Ronald W
• Assistant Examiner(s): Clark, Christopher
• Application Number:
  US15/282,225
• Publication Number:
  US 20170015006A1
• Time in Patent Office: 844 Days
• CPC Class Codes: B25J 15/0085 with means for applying an electrostatic force on the object to be gripped
• CPC Class Codes: B81C 99/002 Apparatus for assembling MEMS, e.g. micromanipulators micromanipulators per se B25J7/00
• CPC Class Codes: H01L 21/67132 Apparatus for placing on an insulating substrate, e.g. tape
• CPC Class Codes: H01L 21/67144 Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
• CPC Class Codes: H01L 21/67259 Position monitoring, e.g. misposition detection or presence detection
• CPC Class Codes: H01L 2224/75251 in the lower part of the bonding apparatus, e.g. in the apparatus chuck
• CPC Class Codes: H01L 2224/75252 in the upper part of the bonding apparatus, e.g. in the bonding head
• CPC Class Codes: H01L 2224/75753 Means for optical alignment, e.g. sensors
• CPC Class Codes: H01L 2224/7598 specially adapted for batch processes
• CPC Class Codes: H01L 24/75 Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/95 at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H02N 13/00 Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

Abstract

Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool includes an articulating transfer head assembly, a carrier substrate holder, and an actuator assembly to adjust a spatial relationship between the articulating transfer head assembly and the carrier substrate holder. The articulating transfer head assembly may include an electrostatic voltage source connection and a substrate supporting an array of electrostatic transfer heads.

Claims

1. A mass transfer tool comprising:

a lower assembly including;

a carrier substrate holder; and

a receiving substrate holder;

a stage located over the lower assembly;

an articulating transfer head assembly mounted on the stage; and

an actuator assembly to move the articulating transfer head assembly in six degrees of freedom.

2. The mass transfer tool of claim 1, wherein the stage is movable within an x-y plane.

3. The mass transfer tool of claim 2, wherein the lower assembly further comprises an upward-viewing imaging device.

4. The mass transfer tool of claim 3, wherein the upward-viewing imaging device is fixed in place relative to the carrier substrate holder.

5. The mass transfer tool of claim 3, wherein the upward-viewing imaging device comprises a digital camera.

6. The mass transfer tool of claim 1, further comprising a first position sensor fixed relative to the transfer head assembly to detect a position of the carrier substrate holder.

7. The mass transfer tool of claim 6, further comprising a second position sensor fixed relative to the carrier substrate holder to detect a position of the articulating transfer head assembly.

8. The mass transfer tool of claim 1, further comprising a flexure to dampen force when contacting the articulating transfer head assembly with a workpiece.

9. The mass transfer tool of claim 8, further comprising a position sensor fixed relative to the transfer head assembly to sense a deflection of the flexure.

10. The mass transfer tool of claim 9, wherein the position sensor comprises a spectral-interference laser displacement sensor.

11. The mass transfer tool of claim 9, wherein the position sensor is configured to detect a 50 nanometer deflection of the flexure.

12. The mass transfer tool of claim 8, wherein the flexure comprises an inner edge, an outer edge, and a plurality of slots between the inner edge and the outer edge.

13. The mass transfer tool of claim 1, further comprising a heater to heat a mounting surface of the articulating transfer head assembly.

14. The mass transfer tool of claim 13, further comprising a second heater coupled with the carrier substrate holder.

15. The mass transfer tool of claim 13, further comprising a third heater coupled with the receiving substrate holder.