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Combined pressure and humidity sensor

  • US 10,184,910 B2
  • Filed: 10/25/2013
  • Issued: 01/22/2019
  • Est. Priority Date: 10/25/2012
  • Status: Active Grant
First Claim
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1. A semiconductor package comprising:

  • a substrate having an upper surface and a lower surface;

    a housing cover having a sidewall portion attached to the substrate and a ceiling portion extending over the upper surface of the substrate, the substrate and the housing cover forming a housing that surrounds and defines a single shared, undivided interior volume;

    a pressure sensor device mounted onto the substrate within the interior volume, the pressure sensor having a top side including a flexible membrane suspended over a hollow space;

    a humidity sensor device mounted onto the substrate within the interior volume with the pressure sensor and including a moisture-sensitive material;

    an evaluation circuit device mounted onto the substrate within the interior volume with the pressure sensor and the humidity sensor and electrically connected to the pressure sensor and the humidity sensor;

    a media opening in the housing that enables gas exchange between the interior volume and an exterior of the housing,wherein the housing cover is spaced apart from each of the pressure sensor, the humidity sensor and the evaluation circuit such that an open space is formed within the interior volume between the housing cover and each of the pressure sensor, the humidity sensor and the evaluation circuit, the media opening being in communication with the open space such that atmospheric conditions within the open space correspond to atmospheric conditions outside of the housing cover,wherein the flexible membrane is arranged facing the ceiling portion of the housing cover with the hollow space positioned on an opposite side of the flexible membrane from the ceiling portion such that the flexible membrane is exposed directly to the open space of the interior volume,wherein the media opening is positioned closer to the moisture-sensitive material of the humidity sensor than the flexible membrane of the pressure sensor, andwherein the media opening is positioned in the housing at a location that is offset laterally from the pressure sensor device and closer to the upper surface than the top side of the pressure sensor device.

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