Modular computer and thermal management

• US 10,185,331 B2
• Filed: 03/06/2014
• Issued: 01/22/2019
• Est. Priority Date: 03/11/2013
• Status: Active Grant

• Current Assignee: ICE Computer, Inc.
• Original Assignee: ICE Computer, Inc.
• Inventors: Cheng, Shang-Che, Wu, Wei-Han, Lin, Chia-Ming
• Primary Examiner(s): Lee, Thomas C
• Assistant Examiner(s): Nguyen, Tri T
• Application Number:
  US14/199,834
• Publication Number:
  US 20140257591A1
• Time in Patent Office: 1,783 Days
• Field of Search: 700300, 36167941, 4555562
• CPC Class Codes: G05D 7/0676 by action on flow sources G05D7/0688, G05D7/0694 take precedence
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: G06F 1/3293 by switching to a less power-consuming processor, e.g. sub-CPU
• CPC Class Codes: G06F 2200/1635 Stackable modules
• CPC Class Codes: Y02D 10/00 Energy efficient computing, e.g. low power processors, power management or thermal management

Abstract

An enclosure design facilitates heat dissipation from a space-limited computer core device. An external computer platform is provided to connect the computer core device, the external computer platform including a fan that provides an air flow to the connected computer core device. The computer core device and the computing platform may be tightly connected by connectors located on their respective enclosure walls. Both the computer core device and the external computing platform are provided air inlets and outlets on their respective enclosures. When connected, an air inlet of the computer core device faces an air outlet of the external computing platform such that a single cooling air flow flows through the external computing platform and the computer core device. The external computing platform may include a built-in fan to blow air into or draw air from the matching air inlets and outlets.

Claims

1. A modular computer configured to couple with an external computing platform, comprising:

an enclosure having a first opening for air to enter into the enclosure provided on a first sidewall of the enclosure and a second opening for air to exit from the enclosure provided at a second sidewall of the enclosure opposite the first sidewall;

a circuit board inside the enclosure on which is mounted one or more memory circuits and a plurality of interface circuits including a power interface circuit, a data interface circuit and a video interface circuit;

an electrical connector provided on an outside face of the first side wall of the enclosure for carrying signals of the interface circuits, the electrical connector being mounted at one end of the circuit board and positioned for mechanically mating and electrically connecting to a matching electrical connector on the external computing platform, the external computing platform comprising a data port and a display port, for driving a display device and a data device, respectively, the electrical connector being positioned such that, when the electrical connector is coupled to the matching electrical connector on the external computing platform, the first opening of the enclosure is aligned to a corresponding opening in the external computing platform such that an air flow driven from the external computing platform is driven into the first opening of the enclosure;

an embedded controller located within the enclosure that detects an air flow-driving device in the external computing platform;

a control circuit mounted on the circuit board and coupled to the embedded controller, the interface circuits and the memory circuits wherein the control circuit comprises first and second processors, the first processor having a greater power requirement than the second processor, and wherein, when the modular computer is connected to the external computing platform, the control circuit selectively activates the first processor, the second processor, or both the first and the second processors, based on the embedded controller'"'"'s detection of the air flow-driving device; and

a cooling module mounted on the control circuit located between the first opening and the second opening of the enclosure such that the air flow driven from the external computing platform flows over or through the cooling module.

2. The modular computer of claim 1, wherein the one or more devices in the external computing platform comprise one or more of:

a peripheral device, a sensor, a power, a thermal management unit, and a control circuit.

3. The modular computer of claim 1, wherein the enclosure is metallic and forms the cooling module.

4. The modular computer of claim 1, wherein the cooling module comprises at least one of:

a metal block, a heat pad, one or more metal plates, a heat pipe, and a heat sink.

5. The modular computer of claim 4, wherein the heat sink is provided at one end of the enclosure, thereby create a chimney effect when the modular computer is disposed in a vertical position.

6. The modular computer of claim 5, wherein the chimney effect facilitates natural ventilation.

7. The modular computer of claim 1, wherein the cooling module guides the air flow inside the enclosure, the cooling module comprising one of:

a mini-fan, a micro-fan, a micro-blower and a Piezoelectric Actuator.

8. The modular computer of claim 1, wherein the air flow flows over one or more of the memory circuits, the interface circuits, the embedded controller and the control circuit.

9. The modular computer of claim 1, wherein the modular computer obtains power from the computing platform through a power interface circuit or from a battery provided inside the enclosure.

10. The modular computer of claim 1, wherein the first and second processors each comprise one or more of:

an x86-based microprocessor, an ARM microprocessor, a hybrid circuit including separately an x86-based microprocessor and an ARM microprocessor, or a hybrid circuit integrating an x86-based microprocessor and an ARM microprocessor.

11. The modular computer of claim 1, wherein the first and second processors comprise a central processing unit and a graphical processing unit, the circuit board further comprising a mass storage unit for storing data that support the central processing unit running application programs and the graphical processing unit playing digital videos.

12. The modular computer of claim 1, wherein the modular computer displays its content using an external display device that is connected to a display port in the external computing platform.

13. The modular computer of claim 12, wherein the modular computer comprises a display that is smaller than the external display device.

14. The modular computer of claim 1, wherein the circuit board comprises one of:

a single base board and a COM Express mini-board integrated with a base board.

15. The modular computer of claim 14, wherein the base board is mounted on the COM Express mini-board.

16. The modular computer of claim 14, wherein the control circuit comprises one of:

(i) a single microprocessor, (ii) a hybrid integrated circuit mounted on the base board, on which both the first and the second processors reside, or a hybrid circuit mounted on a COM Express mini-board, and (iii) a hybrid circuit including the first and second processors separately mounted on a COM Express mini-board and on the base board, respectively.

17. The modular computer of claim 16, wherein the first and second processors share system resources.

18. The modular computer of claim 17, where the system resources are accessible over a proprietary interface.

19. The modular computer of claim 17, wherein the control circuit also selectively executes from the first processor or the second processor under user selection.

20. The modular computer of claim 17, wherein the external computing platform comprises physical input or output ports and power ports accessible by the modular computer.

21. The modular computer of claim 1, wherein the embedded controller requests the control circuit of modular computer to boot up or shut down.

22. The modular computer of claim 21, wherein the embedded controller requests the control circuit of the modular computer to shut down or refrain from booting up when one or more of the following conditions are satisfied:

a request by a control circuit in the external computing platform or by an embedded controller in the external computing platform, and a failure of an authentication mechanism.

23. The modular computer of claim 22, wherein the authentication mechanism comprises one of:

a predefined authentication algorithm, an RFID, a finger print, a key, and a password.

24. The modular computer of claim 22 wherein upon satisfaction of one or more of the conditions, the embedded controller requests a control circuit of the external computing platform to lock the modular computer using a mechanical or electric solenoid lock.

25. The modular computer of claim 24, wherein locking of the modular computer tightens a connection between the modular computer and the external computing platform.

26. The modular computer of claim 25, wherein the embedded controller requests the control circuit of the external computing platform to unlock the mechanical or electric solenoid lock to release the modular computer, after the control circuit of the modular computer shuts down.

27. The modular computer of claim 1, wherein the modular computer displays its contents wirelessly on an external display device using one of the following protocols:

WiDi, Miracast, and AirPlay.

28. The modular computer of claim 27, wherein the modular computer exchanges data wirelessly with an external wireless display device through one or more of the following protocols:

Wifi, and Bluetooth.

29. The modular computer of claim 27, wherein the external display device is selected from the group consisting of:

a display panel, an image projection device, and a group of one or more display units of any display type.

30. The modular computer of claim 1, wherein the modular computer bi-directionally accepts and displays content from an external computing device on an external display device, the external display device being connected to a display port of the external computing platform.

31. The modular computer of claim 30, wherein the modular computing platform is connected to the external computing device through a wireless connection or physical connector on the external computing platform.

32. The modular computer of claim 1, wherein the cooling module comprises a heat sink serving also as an antenna for the modular computer.

33. The modular computer of claim 1, wherein the cooling module comprises a heat sink, and wherein the modular computer further comprises a flexible antenna located in a vicinity of the heat sink.

34. The module computer of claim 33, wherein the flexible antenna is partially or fully surrounded or covered the heat sink.

35. The module computer of claim 33, wherein the heat sink includes fins that are oriented to serve as a reflector for signal reflection onto the flexible antenna.

36. The module computer of claim 1, wherein the cooling module comprises a heat sink and wherein the modular computer further comprises a flexible antenna located such that the heat sink does not block signals to be received into the modular computer.

37. The modular computer of claim 1, wherein the first and second processors are provided in a hybrid circuit including separately an x86-based microprocessor and an ARM microprocessor, or a hybrid circuit integrating an x86-based microprocessor and an ARM microprocessor.

38. The modular computer of claim 1, wherein the control circuit sends video signals and data signals over the electrical connector to the display port and the data port to drive the display device and the data device, respectively.