Light emitting diode display device
First Claim
1. A light emitting diode (LED) display device, comprising:
- a substrate;
at least one first bonding pad and at least one second bonding pad, disposed on the substrate;
at least one spacer located between the at least one first bonding pad and the at least one second bonding pad, wherein a height of the at least one spacer is P μ
m;
at least one LED disposed on the substrate and comprising a first electrode and a second electrode, wherein the first electrode and the second electrode have a height H μ
m; and
a conductive paste layer disposed on the substrate and located between the substrate and the at least one LED, the conductive paste layer comprising a plurality of conductive particles, wherein the first electrode and the second electrode of the at least one LED are respectively electrically connected to the at least one first bonding pad and the at least one second bonding pad of the substrate through the plurality of conductive particles, and H+3.5 μ
m≥
P μ
m≥
H+0.48 μ
m.
1 Assignment
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Accused Products
Abstract
The disclosure provides an LED display device including a substrate, at least one first bonding pad and at least one second bonding pad, at least one spacer, at least one LED, and a conductive paste layer. The first and the second bonding pads are disposed on the substrate. The spacer is located between the first and the second bonding pads, wherein a height of the spacer is P μm. The LED is disposed on the substrate and includes a first electrode and a second electrode. The first and the second electrodes have a height H μm. The conductive paste layer is located between the substrate and the LED and includes a plurality of conductive particles. The first and the second electrodes are respectively electrically connected to the first and the second bonding pads through the conductive particles, and H+3.5 μm≥P μm≥H+0.48 μm.
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Citations
9 Claims
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1. A light emitting diode (LED) display device, comprising:
-
a substrate; at least one first bonding pad and at least one second bonding pad, disposed on the substrate; at least one spacer located between the at least one first bonding pad and the at least one second bonding pad, wherein a height of the at least one spacer is P μ
m;at least one LED disposed on the substrate and comprising a first electrode and a second electrode, wherein the first electrode and the second electrode have a height H μ
m; anda conductive paste layer disposed on the substrate and located between the substrate and the at least one LED, the conductive paste layer comprising a plurality of conductive particles, wherein the first electrode and the second electrode of the at least one LED are respectively electrically connected to the at least one first bonding pad and the at least one second bonding pad of the substrate through the plurality of conductive particles, and H+3.5 μ
m≥
P μ
m≥
H+0.48 μ
m. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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Specification