Light emitting diode display device

• US 10,186,548 B2
• Filed: 08/16/2017
• Issued: 01/22/2019
• Est. Priority Date: 08/19/2016
• Status: Active Grant

• Current Assignee: InnoLux Corporation
• Original Assignee: InnoLux Corporation
• Inventors: Chu, Wei-Cheng, Jiang, Ming-Fu, Jhang, Gu-Jhong
• Primary Examiner(s): Dang, Phuc T
• Application Number:
  US15/678,128
• Publication Number:
  US 20180053808A1
• Time in Patent Office: 524 Days
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 27/156 two-dimensional arrays
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/44 characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

The disclosure provides an LED display device including a substrate, at least one first bonding pad and at least one second bonding pad, at least one spacer, at least one LED, and a conductive paste layer. The first and the second bonding pads are disposed on the substrate. The spacer is located between the first and the second bonding pads, wherein a height of the spacer is P μm. The LED is disposed on the substrate and includes a first electrode and a second electrode. The first and the second electrodes have a height H μm. The conductive paste layer is located between the substrate and the LED and includes a plurality of conductive particles. The first and the second electrodes are respectively electrically connected to the first and the second bonding pads through the conductive particles, and H+3.5 μm≥P μm≥H+0.48 μm.

Claims

1. A light emitting diode (LED) display device, comprising:

a substrate;

at least one first bonding pad and at least one second bonding pad, disposed on the substrate;

at least one spacer located between the at least one first bonding pad and the at least one second bonding pad, wherein a height of the at least one spacer is P μ

m;

at least one LED disposed on the substrate and comprising a first electrode and a second electrode, wherein the first electrode and the second electrode have a height H μ

m; and

a conductive paste layer disposed on the substrate and located between the substrate and the at least one LED, the conductive paste layer comprising a plurality of conductive particles, wherein the first electrode and the second electrode of the at least one LED are respectively electrically connected to the at least one first bonding pad and the at least one second bonding pad of the substrate through the plurality of conductive particles, and H+3.5 μ

m≥

P μ

m≥

H+0.48 μ

m.

2. The light emitting diode (LED) display device according to claim 1, wherein a width of the at least one spacer is X μ

m and a gap between the first electrode and the second electrode of the at least one LED is S μ

m, and S μ

m≥

X μ

m≥

S−

3.5 μ

m.

3. The light emitting diode (LED) display device according to claim 1, wherein the substrate comprises a glass substrate, a flexible plastic substrate, a thin-film transistor substrate, a flexible circuit board, or a printed circuit board.

4. The light emitting diode (LED) display device according to claim 1, wherein the substrate comprises an upper surface, and the at least one first bonding pad and the at least one second bonding pad are disposed on the upper surface or embedded in the substrate.

5. The light emitting diode (LED) display device according to claim 1, further comprising:

a plurality of light-shielding patterns disposed on the substrate, wherein the at least one LED comprises a plurality of LEDs, and the plurality of light-shielding patterns and the plurality of LEDs are alternately arranged.

6. The light emitting diode (LED) display device according to claim 5, further comprising:

a plurality of positioning structures disposed on the substrate, wherein at least two of the plurality of LEDs are located between any two of the plurality of positioning structures.

7. The light emitting diode (LED) display device according to claim 1, wherein the conductive paste layer comprises a UV-curable anisotropic conductive film, a liquid anisotropic conductive paste, an anisotropic conductive paste, an anisotropic conductive film, or a thermosetting anisotropic conductive film.

8. The light emitting diode (LED) display device according to claim 1, wherein the conductive paste layer comprises a plurality of patterned conductive parts, each of the plurality of patterned conductive parts comprising a first patterned conductive part corresponding to the at least one first bonding pad and a second patterned conductive part corresponding to the at least one second bonding pad, the plurality of conductive particles are dispersedly disposed in the first patterned conductive part and the second patterned conductive part.

9. The light emitting diode (LED) display device according to claim 1, wherein the conductive paste layer comprises a plurality of patterned conductive parts, each of the plurality of patterned conductive parts comprising a first patterned conductive part corresponding to the at least one first bonding pad and a second patterned conductive part corresponding to the at least one second bonding pad, the plurality of conductive particles are disposed in the first patterned conductive part and the second patterned conductive part, the first patterned conductive part corresponds to one of the plurality of conductive particles, the second patterned conductive part corresponds to one of the plurality of conductive particles, and the plurality of conductive particles are arranged in matrices.