Wireless communication device and power measurement device equipped with the same

• US 10,187,095 B2
• Filed: 04/30/2018
• Issued: 01/22/2019
• Est. Priority Date: 07/08/2016
• Status: Active Grant

• Current Assignee: Renesas Electronics Corporation
• Original Assignee: Renesas Electronics Corporation
• Inventors: Wang, Ningyi
• Primary Examiner(s): Phu, Sanh D
• Application Number:
  US15/967,321
• Publication Number:
  US 20180248574A1
• Time in Patent Office: 267 Days
• Field of Search: 455298
• CPC Class Codes: H02M 3/04 by static converters
• CPC Class Codes: H04B 1/1018 noise filters connected between the power supply and the receiver suppression or limitation of noise from electric apparatus H04B15/00; demodulation H03D; ripple filters H02M1/14; filters in general 95G, H03H; power supplies H04B1/1607
• CPC Class Codes: H04B 1/1607 Supply circuits converters H02M; filters therefor H02M1/14; voltage stabilisers G05F1/46

Abstract

A semiconductor device includes a semiconductor chip. The semiconductor chip includes: a switching-type DC-DC converter; a pad for receiving a high frequency signal from an antenna; a balun connected to the pad and configured with a coil to output a differential signal based on the high frequency signal; an internal circuit driven by an output voltage of the DC-DC converter to process the differential signal output from the balun; and a ground voltage line that couples the internal circuit to a ground voltage source. The ground voltage line includes a first partial ground voltage line, and a second partial ground voltage line arranged to face the first partial ground voltage line with the balun interposed therebetween.

Claims

1. A semiconductor device comprising a semiconductor chip, wherein the

semiconductor chip includes:

a switching-type DC-DC converter;

a pad for receiving a high frequency signal from an antenna;

a balun connected to the pad and configured with a coil to output a differential signal based on the high frequency signal;

an internal circuit driven by an output voltage of the DC-DC converter to process the differential signal output from the balun; and

a ground voltage line that couples the internal circuit to a ground voltage source,

wherein the ground voltage line comprises;

a first partial ground voltage line; and

a second partial ground voltage line arranged to face the first partial ground voltage line with the balun interposed therebetween.

2. The semiconductor device according to claim 1,

wherein a distance between the first partial ground voltage line and an outer periphery of the coil configuring the balun and a distance between the second partial ground voltage line and the outer periphery of the coil configuring the balun are substantially the same.

3. The semiconductor device according to claim 1,

wherein a width of the first partial ground voltage line and a width of the second partial ground voltage line are substantially the same.

4. The semiconductor device according to claim 1,

wherein the first partial ground voltage line and the second partial ground voltage line are arranged symmetrically with respect to the balun.

5. The semiconductor device according to claim 1, further comprising a power supply voltage line through which the output voltage of the DC-DC converter is propagated from the DC-DC converter to the internal circuit,

wherein the power supply voltage line comprises:

a first partial power supply voltage line; and

a second partial power supply voltage line arranged to face the first power supply voltage line with the balun interposed therebetween.

6. The semiconductor device according to claim 5,

wherein the first and second partial power supply voltage lines are arranged in such a way that a difference between a noise received at one output terminal of the balun from the DC-DC converter and a noise received at another output terminal of the balun from the DC-DC converter is within a predetermined allowable range.

7. The semiconductor device according to claim 5,

wherein the first and second partial power supply voltage lines are arranged in such a way that there is virtually no difference between a noise received at one output terminal of the balun from the DC-DC converter and a noise received at another output terminal of the balun from the DC-DC converter.

8. The semiconductor device according to claim 5,

wherein a distance between the first partial power supply voltage line and an outer periphery of the coil configuring the balun and a distance between the second power supply voltage line and an outer periphery of the coil configuring the balun are substantially the same.

9. The semiconductor device according to claim 5,

wherein a width of the first partial power supply voltage line and a width of the second partial power supply voltage line are substantially the same.

10. The semiconductor device according to claim 5,

wherein the first partial power supply voltage line and the second partial power supply voltage line are arranged symmetrically with respect to the balun.

11. The semiconductor device according to claim 1,

wherein the internal circuit comprises a low noise amplifier that amplifies the differential signal.

12. A power measurement device comprising a semiconductor device comprising a semiconductor chip,

wherein the semiconductor chip includes:

a switching-type DC-DC converter;

a pad for receiving a high frequency signal from an antenna;

a balun connected to the pad and configured with a coil to output a differential signal based on the high frequency signal;

an internal circuit driven by an output voltage of the DC-DC converter to process the differential signal output from the balun; and

a ground voltage line that couples the internal circuit to a ground voltage source,

wherein the ground voltage line comprises;

a first partial ground voltage line; and

a second partial ground voltage line arranged to face the first partial ground voltage line with the balun interposed therebetween.