×

Head mounted computing device, adhesive joint system and method

  • US 10,187,977 B2
  • Filed: 06/29/2015
  • Issued: 01/22/2019
  • Est. Priority Date: 06/29/2015
  • Status: Active Grant
First Claim
Patent Images

1. An adhesive joint system, comprising:

  • a circuit board including a distal end and a proximal end mounted on a first side via a tongue and groove connection to a housing, the tongue and groove connection including a tongue and a groove and a gap between the tongue and the groove;

    an adhesive positioned at least in the gap surrounding the tongue;

    an electrical component mounted to the distal end on a second side of the circuit board that is opposite the first side, wherein respective coefficients of thermal expansion of the tongue, adhesive, and material defining the groove are related such that as heat is applied to the tongue and groove connection, the adhesive is compressed within the gap; and

    a flow channel that is contiguous with the groove and configured to accommodate adhesive that is bled out of the groove when the adhesive is compressed in the groove.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×