Light source circuit unit and lighting device comprising same

• US 10,191,206 B2
• Filed: 06/11/2014
• Issued: 01/29/2019
• Est. Priority Date: 06/27/2013
• Status: Active Grant

• Current Assignee: LG Innotek Company Limited (LG Corporation)
• Original Assignee: LG Innotek Company Limited (LG Corporation)
• Inventors: Choi, Man Hue, Kim, Min Jae, Kim, Bi Yi, Na, Se Woong, Park, Hyun Gyu, Cho, In Hee, Hong, Seung Kwon
• Primary Examiner(s): Song, Zheng
• Application Number:
  US14/901,028
• Publication Number:
  US 20170003441A1
• Time in Patent Office: 1,693 Days
• CPC Class Codes: G02B 6/0083 Details of electrical connections of light sources to drivers, circuit boards, or the like
• CPC Class Codes: G02B 6/0085 Means for removing heat created by the light source from the package heat extraction or cooling elements for semiconductor light sources in general H01L33/64
• CPC Class Codes: G02B 6/0091 of the light source relative to the light guide G02B6/0021 takes precedence
• CPC Class Codes: G02F 1/133615 Edge-illuminating devices, i.e. illuminating from the side
• CPC Class Codes: H05K 1/021 Components thermally connected to metal substrates or heat-sinks by insert mounting
• CPC Class Codes: H05K 1/05 Insulated conductive substrates, e.g. insulated metal substrate
• CPC Class Codes: H05K 1/111 Pads for surface mounting, e.g. lay-out
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10128 Display
• CPC Class Codes: H05K 2201/2009 Reinforced areas, e.g. for a specific part of a flexible printed circuit
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20

Abstract

A light source circuit unit and a lighting device including the light source circuit unit that are configured such that a bent-type metal substrate is formed on an upper surface of the printed circuit board so that the occurrence of a defect due to circuit damage at a bent part upon bending the substrate can be prevented, and slimness and a heat-dissipation property of a device can be improved. The light source circuit board includes: a substrate having a first part with at least one opening portion, and a second part bent from the first part; a printed circuit board on one surface of the substrate; and a light source element mounted to the printed circuit board and inserted into the opening portion, the light source element emitting light to an opposing side of the substrate.

Claims

1. A light source circuit unit comprising:

a printed circuit board comprising;

a pad part extending from a first bent part in a first direction; and

a string part extending from the first bent part in a second direction perpendicular to the first direction and having a string wiring;

a substrate comprising;

a first part disposed on the pad part and having at least one opening portion; and

a second part bent from the first part at a second bent part which is matched with the first bent part and disposed on the string part; and

a light source element mounted on the pad part by inserting the light source element through the at least one opening portion, and emitting light to an opposing side of the substrate,

wherein a connection wiring for connecting the pad part and the string wiring is disposed on the printed circuit board,

wherein the substrate has at least one bending hole formed on the second bent part along a portion where the connection wiring is not disposed,

wherein the string wiring is disposed to be spaced apart from the first bent part along a longitudinal direction of the string part and parallel to the first bent part, and

wherein the connection wiring extends from the light source element to the string part through the first bent part, and transmits an electrical signal from the string wiring to the light source element.

2. The light source circuit unit of claim 1, wherein the substrate is made of a metallic material.

3. The light source circuit unit of claim 1, wherein the printed circuit board is a flexible printed circuit board.

4. The light source circuit unit of claim 1, wherein a thickness of the first part with the opening portion is larger than a thickness of the light source element.

5. The light source circuit unit of claim 4, wherein at least one light source element is received in the opening portion.

6. The light source circuit unit of claim 1, wherein the substrate contains at least one material having high thermal conductivity selected from among Al, Cu, Ag, Au, Cr, Mo, Mg, and Ni.

7. The light source circuit unit of claim 1, further comprising an insulating layer disposed on the string wiring and the connection wiring.

8. The light source circuit unit of claim 1, wherein the light source element does not come into contact with the substrate.

9. The light source circuit unit of claim 8, further comprising a conductive filler disposed in the opening portion of the first part and between the substrate and the light source element.

10. The light source circuit unit of claim 9, wherein the conductive filler is a thermal conductive material.

11. A lighting device comprising:

a light source circuit unit; and

a light guide plate on which a substrate of the light source circuit unit is mounted, and which is disposed with a gap on a light-emitting surface of a light source element of the light source circuit unit, the light guide plate guiding light emitted from the light source element,

wherein the light source circuit unit comprises;

a printed circuit board comprising;

a pad part extending from a first bent part in a first direction; and

a string part extending from the first bent part in a second direction perpendicular to the first direction and having a string wiring;

a substrate comprising;

a first part disposed on the pad part and having at least one opening portion; and

a second part bent from the first part at a second bent part which is matched with the first bent part and disposed on the string part; and

the light source element mounted on the pad part through the opening portion, and emitting light to an opposing side of the substrate,

wherein a connection wiring for connecting the pad part and the string wiring is disposed on the printed circuit board,

wherein the substrate has at least one bending hole formed on the second bent part along a portion where the connection wiring is not disposed,

wherein the string wiring is disposed to be spaced apart from the first bent part along a longitudinal direction of the string part and parallel to the first bent part, and

wherein the connection wiring extends from the light source element to the string part through the first belt part, and transmits an electrical signal from the string wiring to the light source element.

12. The lighting device of claim 11, wherein the substrate is made of a metallic material, and the printed circuit board is a flexible printed circuit board.

13. The lighting device of claim 11, wherein a thickness of the first part with the opening portion is larger than a thickness of the light source element, and at least one light source element is received in the opening portion.

14. The lighting device of claim 11, wherein the substrate contains at least one material having high thermal conductivity selected from among Al, Cu, Ag, Au, Cr, Mo, Mg, and Ni.

15. The lighting device of claim 11, further comprising an insulating layer disposed on the string wiring and the connection wiring.

16. The lighting device of claim 11, further comprising a conductive filler disposed in the opening portion of the first part and between the substrate and the light source element.