Etch variation tolerant optimization

• US 10,191,366 B2
• Filed: 06/01/2015
• Issued: 01/29/2019
• Est. Priority Date: 06/25/2014
• Status: Active Grant

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: ASML Netherlands BV (ASML Holding NV)
• Inventors: Liu, Xiaofeng
• Primary Examiner(s): Young, Christopher G
• Application Number:
  US15/318,940
• Publication Number:
  US 20170139320A1
• Time in Patent Office: 1,338 Days
• Field of Search: 430 5, 430 30, 716 51, 716 53, 716 54, 716 55
• CPC Class Codes: G03F 1/36 Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
• CPC Class Codes: G03F 1/42 Alignment or registration features, e.g. alignment marks on the mask substrates
• CPC Class Codes: G03F 1/44 Testing or measuring features, e.g. grid patterns, focus monitors, sawtooth scales or notched scales
• CPC Class Codes: G03F 7/70125 Use of illumination settings tailored to particular mask patterns details of setting means G03F7/70091
• CPC Class Codes: G03F 7/70433 Layout for increasing efficiency or for compensating imaging errors, e.g. layout of exposure fields for reducing focus errors; Use of mask features for increasing efficiency or for compensating imaging errors
• CPC Class Codes: G03F 7/705 Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
• CPC Class Codes: G06F 2119/18 Manufacturability analysis or optimisation for manufacturability
• CPC Class Codes: G06F 30/00 Computer-aided design [CAD]

Abstract

Disclosed herein is a computer-implemented method to improve a lithographic process for imaging a portion of a design layout onto a substrate using a lithographic projection apparatus and for transferring the imaged portion of the design layout to the substrate by an etching process, which includes the following steps: determining a value of at least one evaluation point of the lithographic process for each of a plurality of variations of the etching process; computing a multi-variable cost function of a plurality of design variables that are characteristics of the lithographic process, wherein the multi-variable cost function is a function of deviation from the determined values of the at least one evaluation point; and reconfiguring the characteristics of the lithographic process by adjusting the design variables until a termination condition is satisfied. This method may reduce the need of repeated adjustment to the lithographic process when the etching process varies.

Claims

1. A method to improve a lithographic process for imaging a portion of a design layout onto a substrate using a lithographic projection apparatus and for transferring the imaged portion of the design layout to the substrate by an etching process, the method comprising:

determining a value of an evaluation point of the lithographic process for each of a plurality of variations of the etching process;

computing, by a hardware computer system, a multi-variable cost function of a plurality of design variables that are characteristics of the lithographic process, wherein the multi-variable cost function is a function of a deviation from the determined values of the evaluation point; and

reconfiguring one or more of the characteristics of the lithographic process by adjusting one or more of the design variables and re-evaluating the cost function, until a termination condition for the cost function is satisfied.

2. The method of claim 1, wherein the deviation is a function of one or more of the design variables.

3. The method of claim 1, wherein the deviation is a function of a difference between an actual or simulated value of the evaluation point and the determined value of the evaluation point.

4. The method of claim 1, wherein the evaluation point is selected from:

a point of a resist image, of an aerial image or of the design layout, dose, focus, throughput, process window, critical dimension, resist contour distance, worst defect size, or best focus shift.

5. The method of claim 1, wherein the deviation is an edge placement error.

6. The method of claim 1, wherein at least one of the design variables is a characteristic of an illumination of a patterning device, the design layout, projection optics, or a combination thereof.

7. The method of claim 1, wherein the portion of the design layout comprises one or more selected from:

the entire design layout, a clip, a section of the design layout that is known to have a critical feature, or a section of the design layout where a critical feature has been identified by a pattern selection method.

8. The method of claim 1, wherein the termination condition includes one or more selected from:

minimization of the cost function;

maximization of the cost function;

reaching a preset number of iterations;

reaching a value of the cost function equal to or beyond a preset threshold value;

reaching a computation time;

or reaching a value of the cost function within an acceptable error limit.

9. The method of claim 1, wherein iterative reconfiguration is performed with a constraint dictating a range of at least one of the design variables.

10. The method of claim 9, wherein the constraint includes one or more selected from:

a tuning range, a rule governing patterning device manufacturability, or interdependence between the design variables.

11. The method of claim 1, wherein determining the value of the evaluation point comprises determining a bias of a pattern in the portion of the design layout.

12. The method of claim 1, wherein the design layout comprises an assist feature, and wherein the assist feature comprises a sub-resolution assist feature.

13. A method to improve a lithographic process for imaging a portion of a design layout onto a substrate using a lithographic projection apparatus and for transferring the imaged portion of the design layout to the substrate by an etching process, the method comprising:

determining a value of an evaluation point of the lithographic process for each of a plurality of variations of the etching process;

computing, by a hardware computer system, a multi-variable cost function of a plurality of design variables that are characteristics of the lithographic process, wherein the multi-variable cost function is a function of a deviation from the determined values of the evaluation point, wherein the plurality of design variables comprise the evaluation point; and

reconfiguring one or more of the characteristics of the lithographic process by adjusting one or more of the design variables and re-evaluating the cost function, until a termination condition for the cost function is satisfied.

14. The method of claim 13, wherein the evaluation point is selected from:

a point of a resist image, of an aerial image or of the design layout, dose, focus, throughput, process window, critical dimension, resist contour distance, worst defect size, or best focus shift.

15. A computer program product comprising a non-transitory computer readable medium having instructions recorded thereon, the instructions configured to cause a computer to at least:

for a lithographic process for imaging a portion of a design layout onto a substrate using a lithographic projection apparatus and for transferring the imaged portion of the design layout to the substrate by an etching process, determine a value of an evaluation point of the lithographic process for each of a plurality of variations of the etching process;

compute a multi-variable cost function of a plurality of design variables that are characteristics of the lithographic process, wherein the multi-variable cost function is a function of a deviation from the determined values of the evaluation point; and

reconfigure one or more of the characteristics of the lithographic process by adjusting one or more of the design variables and re-evaluating the cost function, until a termination condition for the cost function is satisfied.

16. The computer program product of claim 15, wherein the plurality of design variables comprises the evaluation point.

17. The computer program product of claim 15, wherein the deviation is a function of one or more of the design variables.

18. The computer program product of claim 15, wherein the deviation is a function of a difference between an actual or simulated value of the evaluation point and the determined value of the evaluation point.

19. The computer program product of claim 15, wherein the evaluation point is selected from:

a point of a resist image, of an aerial image or of the design layout, dose, focus, throughput, process window, critical dimension, resist contour distance, worst defect size, or best focus shift.

20. The computer program product of claim 15, wherein the deviation is an edge placement error.