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Light emitting diode chip

  • US 10,193,019 B2
  • Filed: 04/30/2018
  • Issued: 01/29/2019
  • Est. Priority Date: 05/20/2014
  • Status: Active Grant
First Claim
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1. A light emitting diode chip comprising:

  • a substrate comprising;

    a plurality of recesses; and

    a plurality of protrusions connected between the plurality of the recesses; and

    a light emitting diode element layer disposed on the plurality of the recesses and the plurality of the protrusions,wherein a surface roughness of a surface of one of the plurality of the protrusions does not exceed 10 nanometers.

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