Substrate for supporting antenna pattern and antenna using same

• US 10,193,207 B2
• Filed: 08/24/2015
• Issued: 01/29/2019
• Est. Priority Date: 09/23/2014
• Status: Active Grant

• Current Assignee: Point Engineering Co. Ltd.
• Original Assignee: Point Engineering Co. Ltd.
• Inventors: Ahn, Bum Mo, Park, Seung Ho, Song, Tae Hwan
• Primary Examiner(s): Phan, Tho G
• Application Number:
  US15/511,821
• Publication Number:
  US 20170294700A1
• Time in Patent Office: 1,254 Days
• CPC Class Codes: H01Q 1/002 Protection against seismic waves, thermal radiation or other disturbances, e.g. nuclear explosion; Arrangements for improving the power handling capability of an antenna
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 1/526 Electromagnetic shields
• CPC Class Codes: H01Q 9/0407 Substantially flat resonant element parallel to ground plane, e.g. patch antenna dipole H01Q9/285; monopole H01Q9/40

Abstract

The present invention relates to a substrate for supporting an antenna pattern. The substrate includes a porous anodic oxide layer having a plurality of pores formed by anodizing metal. A metallic material is filled in at least a part of the pores.

Claims

1. A substrate for supporting an antenna pattern, comprising:

a porous anodic oxide layer having a plurality of pores formed by anodizing metal;

a first metal pattern formed on the porous anodic oxide layer; and

a second metal pattern formed so as to surround at least a part of the first metal pattern;

wherein metallic materials are filled in the pores positioned below the first and second metal patterns.

2. The substrate of claim 1, wherein the porous anodic oxide layer is a porous aluminum oxide layer formed by anodizing aluminum.

3. The substrate of claim 1, wherein the metallic material includes at least one of a carbon nanotube, graphene, nickel (Ni), silver (Ag), gold (Au), copper (Cu), platinum (Pt), titanium-tungsten alloy (TiW), chromium (Cr) and nickel-chromium alloy (NiCr).

4. The substrate of claim 1, wherein each of the pores is only partially filled with the metallic material.

5. An antenna, comprising:

a porous anodic oxide layer having a plurality of pores formed by anodizing metal;

a first metal pattern formed on the porous anodic oxide layer;

a second metal pattern formed so as to surround at least a part of the first metal pattern;

wherein metallic materials are filled in the pores positioned below the first and second metal patterns.

6. The antenna of claim 5, further comprising a metal base plate,

wherein the metal base plate is anodized to form the plurality of pores.

7. The antenna of claim 6, wherein the metal base plate has an opening portion.

8. The antenna of claim 5, further comprising:

an insulating material layer formed on at least a portion of the porous anodic oxide layer, on at least a portion of the first and second metal patterns, or on at least a portion of the porous anodic oxide layer and the first and second metal patterns.

9. The antenna of claim 5, wherein an outer surface of the metallic material is exposed below the porous anodic oxide layer.

10. The antenna of claim 9, further comprising:

a lower metal layer formed on at least a part of a lower portion of the porous anodic oxide layer.

11. The antenna of claim 5, wherein the porous anodic oxide layer comprises aluminum oxide.

12. An antenna, comprising:

a porous aluminum oxide layer having a plurality of pores formed by anodizing aluminum;

a first metal pattern formed on the porous aluminum oxide layer;

a second metal pattern formed so as to surround at least a part of the first metal pattern;

a first metallic material filled in the pores positioned below the first metal pattern; and

a second metallic material filled in the pores positioned below the second metal pattern;

wherein metallic materials are filled in the pores positioned below the first and second metal patterns.