Smartcards, RFID devices, wearables and methods
First Claim
1. An RFID device comprising:
- an RFID chip (IC);
a module antenna (MA) connected to the RFID chip (IC);
a coupling frame (CF) having a slit (S) or non-conductive stripe (NCS) overlapping at least a portion of the module antenna (MA); and
a capacitor connected across the slit (S) or non-conductive stripe (NCS).
2 Assignments
0 Petitions
Accused Products
Abstract
Coupling frames comprising a conductive (metal) surface with a slit (S) or non-conductive stripe (NCS) extending from an outer edge to an inner position thereof, and overlapping a transponder device. A coupling frame with slit for coupling with an inductive or capacitive device (inductor or capacitor) may be used at any ISM frequency band to concentrate surface current around the slit. The coupling frame can be tuned to operate at a frequency of interested by introducing a resistive, inductive or capacitive element. The resonance frequency of the coupling frame can be matched to that of the transponder chip module to achieve optimum performance. Coupling frames with or without a transponder device may be integrated, overlapping, stacked or placed adjacent to one another to enhance system performance. Multiple coupling frames may be electrically isolated from one another by the application of a dielectric coating such Diamond Like Carbon (DLC).
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Citations
16 Claims
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1. An RFID device comprising:
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an RFID chip (IC); a module antenna (MA) connected to the RFID chip (IC); a coupling frame (CF) having a slit (S) or non-conductive stripe (NCS) overlapping at least a portion of the module antenna (MA); and a capacitor connected across the slit (S) or non-conductive stripe (NCS). - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method of improving coupling between an RFID device comprising a transponder chip module (TCM) and an external reader, the transponder chip module (TCM) comprising an RFID chip (IC, CM) and a module antenna (MA), characterized by:
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incorporating an open-loop conductive coupling frame (CF) in the transponder chip module (TCM), wherein the coupling frame (CF) has a slit (S) or non-conductive stripe (NCS) extending from an outer edge (OE) thereof to an interior position thereof and coupling frame (CF) is positioned so that the slit (S) or non-conductive stripe (NCS) overlaps at least a portion of the module antenna (MA, PA, LES); and connecting a capacitor across the slit (S) or non-conductive stripe (NCS). - View Dependent Claims (12, 13, 14, 15, 16)
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Specification