Substrate and terminals for power module and power module including the same

• US 10,193,250 B2
• Filed: 08/02/2017
• Issued: 01/29/2019
• Est. Priority Date: 02/07/2013
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Kim, Che-heung, Kim, Chang-sik, Booh, Seong-woon
• Primary Examiner(s): Milakovich, Nathan
• Application Number:
  US15/666,745
• Publication Number:
  US 20170331209A1
• Time in Patent Office: 545 Days
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48139 with an intermediate bond, e.g. continuous wire daisy chain
• CPC Class Codes: H01L 2224/49111 the connectors connecting two common bonding areas, e.g. Litz or braid wires
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01R 12/7088 Arrangements for power supply
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections

Abstract

According to example embodiments, a substrate for a power module includes a first part, a second part, and a third part on a same surface of an underlying part of the substrate. The first part, the second part, and the third part may be spaced apart from each other, electrically insulated from each other, and not directly contacting each other. The third part may surround the first part and the second part. A first element module may be on the third part. The first part, the second part, and the third part may be conductive.

Claims

1. A substrate for a power module, comprising:

a first part, a second part, and a third part on a same surface of an underlying part of the substrate, wherein

the first part, the second part, and the third part are spaced apart from each other, electrically insulated from each other, and not directly contacting each other,

the third part surrounds the first part and the second part,

the third part is a continuous structure,

a first element module is on the third part,

all of the first part, the second part, and the third part are conductive,

the third part defines an opening over the same surface of the underlying part of the substrate,

the first part and the second part are in the opening defined by the third part,

the opening is between a first region of the third part and a second region of the third part,

the first region of the third part and the second region of the third part are spaced apart from each other in a first direction,

the first region of the third part includes a control pin installation region or an output terminal installation region, and

a width of the first region of the third part in the first direction is different than a width of the second region of the third part in the first direction.

2. The substrate for a power module of claim 1, further comprising:

a second element module on one of the first part and the second part.

3. The substrate for a power module of claim 1, wherein

the third part comprises the control pin installation region and the output terminal installation region,

the first region of the third part includes the control pin installation region, and

the third part includes the output terminal installation region at a location between the first region of the third part and the second region of the third part.

4. The substrate for a power module of claim 1, wherein

the first part and the second part are parallel with each other, and

the first part and the second part have no protruding parts.

5. The substrate for a power module of claim 1, wherein, in a plan view,

an outer sidewall of the third part surrounds an entire outer sidewall of the first part, and

the outer sidewall of the third part surrounds an entire outer sidewall of the second part.

6. The substrate for a power module of claim 1, wherein

the opening is between a third region of the third part and a fourth region of the third part,

the third region of the third part and the fourth region of the third part are spaced apart from each other in a second direction that crosses the first direction,

a width of the third region of the third part in the second direction is different than a width of the fourth region of the third part in the second direction, and

the third region of the third part and the fourth region of the third part are between the first region of the third part and the second region of the third part.

7. The substrate for a power module of claim 6, wherein

the first region of the third part includes the control pin installation region,

the fourth region of the third part includes the output terminal installation region,

the first element module is on the third region of the third part, and

the width of the third region of the third part is greater than the width of the fourth region of the third part.

8. The substrate for a power module of claim 7, wherein

the first element module is an IGBT device.

9. The substrate for a power module of claim 1, wherein

the width of the first region of the third part is greater than the width of the second region of the third part.

10. The substrate for a power module of claim 9, wherein

the first region of the third part includes the control pin installation region.

11. The substrate for a power module of claim 1, wherein

the width of the first region of the third part is less than the width of the second region of the third part.

12. The substrate for a power module of claim 11, wherein

the first region of the third part includes the output terminal installation region.

13. A substrate for a power module, comprising:

a first part, a second part, and a third part on a same surface of an underlying part of the substrate, wherein

the first part, the second part, and the third part are spaced apart from each other, electrically insulated from each other, and not directly contacting each other,

the third part surrounds the first part and the second part,

the third part is a continuous structure,

a first element module is on the third part,

all of the first part, the second part, and the third part are conductive, and

the first element module is an IGBT device.

14. The substrate for a power module of claim 13, further comprising:

a second element module on one of the first part and the second part.

15. The substrate for a power module of claim 13, wherein

the first part and the second part are parallel with each other, and

the first part and the second part have no protruding parts.

16. The substrate for a power module of claim 13, wherein, in a plan view,

an outer sidewall of the third part surrounds an entire outer sidewall of the first part, and

the outer sidewall of the third part surrounds an entire outer sidewall of the second part.

17. A substrate for a power module, comprising:

a first part, a second part, and a third part on a same surface of an underlying part of the substrate, wherein

the first part, the second part, and the third part are spaced apart from each other, electrically insulated from each other, and not directly contacting each other,

the third part surrounds the first part and the second part,

the third part is a continuous structure,

a first element module is on the third part,

all of the first part, the second part, and the third part are conductive,

the third part defines an opening over the same surface of the underlying part of the substrate,

the first part and the second part are in the opening defined by the third part, and

a center of the opening defined by the third part and a central location of the third part are spaced apart from each other in a plan view.

18. The substrate for a power module of claim 17, further comprising:

a second element module on one of the first part and the second part.

19. The substrate for a power module of claim 17, wherein

the first part and the second part are parallel with each other, and

the first part and the second part have no protruding parts.

20. The substrate for a power module of claim 17, wherein, in a plan view,

an outer sidewall of the third part surrounds an entire outer sidewall of the first part, and

the outer sidewall of the third part surrounds an entire outer sidewall of the second part.