Differential pressure sensor full overpressure protection device

• US 10,197,462 B2
• Filed: 05/25/2016
• Issued: 02/05/2019
• Est. Priority Date: 05/25/2016
• Status: Active Grant

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: Brown, Gregory C.
• Primary Examiner(s): Shah, Manish S
• Assistant Examiner(s): Morello, Jean
• Application Number:
  US15/164,696
• Publication Number:
  US 20170343438A1
• Time in Patent Office: 986 Days
• Field of Search: None
• CPC Class Codes: G01L 13/025 using diaphragms
• CPC Class Codes: G01L 19/0618 Overload protection
• CPC Class Codes: G01L 9/0047 Diaphragm with non uniform thickness, e.g. with grooves, bosses or continuously varying thickness
• CPC Class Codes: G01L 9/0048 Details about the mounting of the diaphragm to its support or about the diaphragm edges, e.g. notches, round shapes for stress relief
• CPC Class Codes: G01L 9/0052 of piezoresistive elements circuits therefor G01L9/06
• CPC Class Codes: G01L 9/0055 bonded on a diaphragm

Abstract

A pressure sensor die assembly for a differential pressure sensor comprises a base substrate including a first overpressure stop structure on a first surface, and a diaphragm structure coupled to the first surface. The diaphragm structure comprises a first side with a cavity section that includes a first cavity and a second cavity surrounding the first cavity, and a second side opposite from the first side. A pressure sensing diaphragm portion is defined by the first cavity and is located over the first overpressure stop structure. An overpressure diaphragm portion is defined by the second cavity. A top cap coupled to the second side of the diaphragm structure includes a second overpressure stop structure. The overpressure stop structures are each sized to support substantially all of a strained area of the pressure sensing diaphragm portion at an increasing overpressure on the first or second sides of the diaphragm structure.

Claims

1. A pressure sensor die assembly for a differential pressure sensor, comprising:

a base substrate having a first surface and including a first overpressure stop structure on the first surface;

a diaphragm structure coupled to the first surface and comprising;

a first side with a cavity section that includes a first cavity and a second cavity surrounding the first cavity, and a second side opposite from the first side;

a pressure sensing diaphragm portion having a first thickness and defined by the first cavity, the pressure sensing diaphragm portion located over and spaced apart from the first overpressure stop structure such that the first overpressure stop structure protrudes into a portion of the first cavity; and

an overpressure diaphragm portion having a second thickness and defined by the second cavity, the second thickness greater than the first thickness of the pressure sensing diaphragm portion;

wherein the pressure sensing diaphragm portion has a pressure sensing surface on the second side of the diaphragm structure opposite from the first side; and

a top cap coupled to the second side of the diaphragm structure and having a lower surface, the top cap including a second overpressure stop structure on the lower surface, wherein a gap is located between the pressure sensing surface and the second overpressure stop structure prior to overpressure being applied;

wherein when overpressure is applied to the first side of the diaphragm structure, at least some area of the pressure sensing diaphragm portion is deflected such that at least a portion of the pressure sensing surface is in contact with the second overpressure stop structure;

wherein when overpressure is applied to the second side of the diaphragm structure, at least some area of the pressure sensing diaphragm portion is deflected and supported by the first overpressure stop structure;

wherein the first and second overpressure stop structures are each sized to support substantially all of a strained area of the pressure sensing diaphragm portion at an increasing overpressure on the first or second sides of the diaphragm structure.

2. The pressure sensor die assembly of claim 1, wherein the base substrate, the diaphragm structure, and the top cap each include a material comprising silicon, germanium, sapphire, glass, a metal, or a ceramic.

3. The pressure sensor die assembly of claim 1, wherein the overpressure diaphragm portion has a stiffness that is greater than a stiffness of the pressure sensing diaphragm portion.

4. The pressure sensor die assembly of claim 1, wherein the first cavity has a first depth, and the second cavity has second depth that is less than the first depth.

5. The pressure sensor die assembly of claim 4, wherein the first cavity and the second cavity are concentric circular cavities, such that the overpressure diaphragm portion has an outer circumference that is greater than an outer circumference of the pressure sensing diaphragm portion.

6. The pressure sensor die assembly of claim 4, wherein the first cavity and the second cavity are rectangular cavities.

7. The pressure sensor die assembly of claim 1, wherein the first overpressure stop structure protrudes into a portion of the first cavity such that a gap is maintained between the first overpressure stop structure and the pressure sensing diaphragm portion prior to overpressure being applied to the diaphragm structure.

8. The pressure sensor die assembly of claim 1, further comprising a plurality of piezoelectric bridge resistors coupled to the pressure sensing surface, the piezoelectric bridge resistors electrically connected to a plurality of bond pads on the diaphragm structure.

9. The pressure sensor die assembly of claim 8, wherein the lower surface of the top cap includes multiple recessed areas adjacent to the second overpressure stop structure, and multiple undercut portions around a lower periphery of the top cap.

10. The pressure sensor die assembly of claim 9, wherein the multiple recessed areas are configured to provide clearance for the piezoelectric bridge resistors when overpressure is applied to the first side of the diaphragm structure.

11. The pressure sensor die assembly of claim 10, wherein the top cap is smaller in area than the diaphragm structure such that the bond pads on the diaphragm structure are located outside a periphery of the top cap.

12. The pressure sensor die assembly of claim 11, wherein interconnections to the bond pads from the piezoelectric bridge resistors run through the undercut portions.

13. The pressure sensor die assembly of claim 1, wherein the pressure sensor die assembly is configured for exposure to an overpressure of up to about 100 times full scale.

14. A differential pressure sensor, comprising:

a base substrate including a first overpressure stop structure on a first surface of the base substrate;

a diaphragm structure coupled to the first surface and comprising;

a first side with a cavity section that includes a first cavity and a second cavity surrounding the first cavity, and a second side opposite from the first side;

a pressure sensing diaphragm portion having a first thickness and defined by the first cavity, the pressure sensing diaphragm portion located over and spaced apart from the first overpressure stop structure such that the first overpressure stop structure protrudes into a portion of the first cavity; and

an overpressure diaphragm portion having a second thickness and defined by the second cavity, the second thickness greater than the first thickness of the pressure sensing diaphragm portion; and

a top cap coupled to the second side of the diaphragm structure and having a lower surface, the top cap including a second overpressure stop structure on the lower surface, wherein a gap is located between the pressure sensing diaphragm portion and the second overpressure stop structure prior to overpressure being applied;

wherein the first and second overpressure stop structures are each sized to support substantially all of a strained area of the pressure sensing diaphragm portion at an increasing overpressure on the first or second sides of the diaphragm structure.

15. The differential pressure sensor of claim 14, wherein the overpressure diaphragm portion has a stiffness that is greater than a stiffness of the pressure sensing diaphragm portion.

16. The differential pressure sensor of claim 14, wherein the first cavity has a first depth, and the second cavity has second depth that is less than the first depth.

17. The differential pressure sensor of claim 14, wherein the first overpressure stop structure protrudes into a portion of the first cavity such that a gap is maintained between the first overpressure stop structure and the pressure sensing diaphragm portion prior to overpressure being applied to the diaphragm structure.

18. The differential pressure sensor of claim 14, further comprising a plurality of piezoelectric bridge resistors coupled to the pressure sensing surface, the piezoelectric bridge resistors electrically connected to a plurality of bond pads on the diaphragm structure.

19. The differential pressure sensor of claim 18, wherein the lower surface of the top cap includes multiple recessed areas adjacent to the second overpressure stop structure, and multiple undercut portions around a lower periphery of the top cap.

20. The differential pressure sensor of claim 19, wherein the multiple recessed areas are configured to provide clearance for the piezoelectric bridge resistors when overpressure is applied to the first side of the diaphragm structure.