×

Three-dimensional mask model for photolithography simulation

  • US 10,198,549 B2
  • Filed: 06/06/2016
  • Issued: 02/05/2019
  • Est. Priority Date: 08/14/2007
  • Status: Active Grant
First Claim
Patent Images

1. A method comprising:

  • obtaining a plurality of kernels to adapt a thin mask transmission corresponding to a mask design layout for a physical an optical mask configured to create a device pattern for optical projection onto a substrate, to a mask 3D transmission;

    combining, by a hardware computer system, the thin mask transmission and the plurality of kernels to create a mask 3D transmission corresponding to the mask design layout; and

    producing electronic data, using the mask 3D transmission, used to create the optical mask for creating the device pattern,where the electronic data, or information derived therefrom, is configured to guide manufacture of the physical optical mask.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×