Semiconductor module cooling system

• US 10,199,238 B2
• Filed: 02/23/2018
• Issued: 02/05/2019
• Est. Priority Date: 03/03/2015
• Status: Active Grant

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Yoo, Inpil, Grassmann, Andreas
• Primary Examiner(s): Diallo, Mamadou
• Application Number:
  US15/903,913
• Publication Number:
  US 20180182643A1
• Time in Patent Office: 347 Days
• CPC Class Codes: H01L 21/4817 for containers, e.g. caps H01L21/4871 takes precedence
• CPC Class Codes: H01L 21/4875 Connection or disconnection of other leads to or from bases or plates
• CPC Class Codes: H01L 21/4882 Assembly of heatsink parts
• CPC Class Codes: H01L 21/54 Providing fillings in containers, e.g. gas fillings
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 23/08 the material being an electrical insulator, e.g. glass
• CPC Class Codes: H01L 23/18 Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/3142 Sealing arrangements between parts, e.g. adhesion promotors
• CPC Class Codes: H01L 23/3672 Foil-like cooling fins or heat sinks being part of lead-frames H01L23/49568
• CPC Class Codes: H01L 23/3737 Organic materials with or without a thermoconductive filler
• CPC Class Codes: H01L 23/44 the complete device being wholly immersed in a fluid other than air H01L23/427 takes precedence
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 23/49811 Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence

Abstract

A cooling apparatus includes a discrete module and a plastic housing. The discrete module includes a semiconductor die encapsulated by a mold compound, a plurality of leads electrically connected to the semiconductor die and protruding out of the mold compound and a first cooling plate at least partly uncovered by the mold compound. The plastic housing surrounds the periphery of the discrete module. The plastic housing includes a first singular plastic part which receives the discrete module and a second singular plastic part attached to a periphery of the first plastic part. The second plastic part has a cutout which exposes at least part of the first cooling plate and a sealing structure containing a sealing material which forms a water-tight seal around the periphery of the discrete module at a side of the discrete module with the first cooling plate.

Claims

1. A cooling apparatus, comprising:

a discrete module comprising;

a semiconductor die encapsulated by a mold compound;

a plurality of leads electrically connected to the semiconductor die and protruding out of the mold compound; and

a first cooling plate at least partly uncovered by the mold compound; and

a plastic housing surrounding a periphery of the discrete module, the plastic housing comprising;

a first singular plastic part which receives the discrete module; and

a second singular plastic part attached to a periphery of the first plastic part, the second plastic part having a cutout which exposes at least part of the first cooling plate and a sealing structure containing a sealing material which forms a water-tight seal around the periphery of the discrete module at a side of the discrete module with the first cooling plate.

2. The cooling apparatus of claim 1, wherein the sealing structure of the second plastic part comprises a groove formed in the second plastic part which surrounds the periphery of the discrete module at the side of the discrete with the first cooling plate, and wherein the sealing material fills the groove.

3. The cooling apparatus of claim 2, wherein a part of the second plastic part disposed interiorly from the groove contacts the side of the discrete with the first cooling plate to prevent the sealing material from leaking onto the first cooling plate.

4. The cooling apparatus of claim 1, further comprising:

a first cover attached to a periphery of the second plastic part and forming a water-tight seal with the second plastic part; and

an enclosed cavity between the first cover and the second plastic part configured to permit fluid flow over the first cooling plate of the discrete module.

5. The cooling apparatus of claim 1, wherein the discrete module has a second cooling plate at a side opposite the first cooling plate, and wherein the first plastic part has a cutout which exposes at least part of the second cooling plate and a sealing structure containing additional sealing material which forms a water-tight seal around the periphery of the discrete module at the side of the discrete module with the second cooling plate.

6. The cooling apparatus of claim 5, wherein the sealing structure of the first plastic part comprises a groove formed in the first plastic part which surrounds the periphery of the discrete module at the side of the discrete module with the second cooling plate, and wherein the additional sealing material fills the groove in the first plastic part.

7. The cooling apparatus of claim 6, wherein a part of the first plastic part disposed interiorly from the groove contacts the side of the discrete module with the second cooling plate to prevent the additional sealing material from leaking onto the second cooling plate.

8. The cooling apparatus of claim 5, further comprising:

a second cover attached to a periphery of the first plastic part and forming a water-tight seal with the first plastic part; and

an enclosed cavity between the second cover and the first plastic part configured to permit fluid flow over the second cooling plate of the discrete module.

9. The cooling apparatus of claim 5, wherein the first singular plastic part has one or more openings along the length of the first singular plastic part configured to inject the sealing material into the sealing structure of the first singular plastic part.

10. The cooling apparatus of claim 1, wherein the mold compound is an epoxy.

11. The cooling apparatus of claim 1, wherein the leads are formed from a lead-frame.

12. The cooling apparatus of claim 1, wherein the leads are gull-wing, J-lead or flat leads.

13. The cooling apparatus of claim 1, wherein the semiconductor die is an IGBT die, a power MOSFET die, a JFET die, a GaN die, a SiC die, a thyristor die, or a power diode die.

14. The cooling apparatus of claim 1, wherein a plurality of semiconductor dies is included in the discrete module.

15. The cooling apparatus of claim 1, wherein the semiconductor die forms part of a half-bridge circuit, a full-bridge circuit or a 3-phase circuit.

16. The cooling apparatus of claim 1, wherein the cooling plate has surface structures configured to increase the turbulence of fluid flowing over the cooling plate.

17. The cooling apparatus of claim 16, wherein the surface structures are pins, fins or an intentionally roughened surface.

18. The cooling apparatus of claim 1, wherein the first and the second singular plastic parts include one or more openings at one or both ends of the first and the second singular plastic parts configured to allow fluid flow from one side of the plastic housing to an opposite side of the plastic housing.

19. The cooling apparatus of claim 1, wherein the discrete module is seated in a recessed region of the first plastic part.

20. The cooling apparatus of claim 1, wherein the second singular plastic part has one or more openings along the length of the second singular plastic part configured to inject the sealing material into the sealing structure of the second singular plastic part.