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Semiconductor module cooling system

  • US 10,199,238 B2
  • Filed: 02/23/2018
  • Issued: 02/05/2019
  • Est. Priority Date: 03/03/2015
  • Status: Active Grant
First Claim
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1. A cooling apparatus, comprising:

  • a discrete module comprising;

    a semiconductor die encapsulated by a mold compound;

    a plurality of leads electrically connected to the semiconductor die and protruding out of the mold compound; and

    a first cooling plate at least partly uncovered by the mold compound; and

    a plastic housing surrounding a periphery of the discrete module, the plastic housing comprising;

    a first singular plastic part which receives the discrete module; and

    a second singular plastic part attached to a periphery of the first plastic part, the second plastic part having a cutout which exposes at least part of the first cooling plate and a sealing structure containing a sealing material which forms a water-tight seal around the periphery of the discrete module at a side of the discrete module with the first cooling plate.

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