Method of making a sensor package with cooling feature

• US 10,199,519 B2
• Filed: 04/03/2018
• Issued: 02/05/2019
• Est. Priority Date: 12/05/2013
• Status: Active Grant

• Current Assignee: Optiz, Inc.
• Original Assignee: Optiz, Inc.
• Inventors: Oganesian, Vage, Lu, Zhenhua
• Primary Examiner(s): Vu, Hung
• Application Number:
  US15/944,466
• Publication Number:
  US 20180226517A1
• Time in Patent Office: 308 Days
• Field of Search: None
• CPC Class Codes: H01L 21/481 Insulating layers on insulating parts, with or without metallisation
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/17181 On opposite sides of the body
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73257 Bump and wire connectors
• CPC Class Codes: H01L 23/13 characterised by the shape
• CPC Class Codes: H01L 23/367 Cooling facilitated by shape of device H01L23/38, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence
• CPC Class Codes: H01L 23/3672 Foil-like cooling fins or heat sinks being part of lead-frames H01L23/49568
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 23/49833 the chip support structure consisting of a plurality of insulating substrates
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/17 of a plurality of bump connectors
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/18 the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 27/1446 in a repetitive configuration
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/12043 : Photo diode
• CPC Class Codes: H01L 2924/1433 : Application-specific integrated circuit [ASIC]
• CPC Class Codes: H01L 31/02002 : Arrangements for conducting electric current to or from the device in operations
• CPC Class Codes: H01L 31/02005 : for device characterised by at least one potential jump barrier or surface barrier
• CPC Class Codes: H01L 31/02019 : for devices characterised by at least one potential jump barrier or surface barrier
• CPC Class Codes: H01L 31/024 : Arrangements for cooling, heating, ventilating or temperature compensation for photovoltaic devices H01L31/052

Abstract

A sensor device includes a first substrate of semiconductor material having opposing first and second surfaces, photodetectors configured to receive light impinging on the first surface, and first contact pads each exposed at both the first and second surfaces and electrically coupled to at least one of the photodetectors. A second substrate comprises opposing first and second surfaces, electrical circuits, a second contact pads each disposed at the first surface of the second substrate and electrically coupled to at least one of the electrical circuits, and a plurality of cooling channels formed as first trenches extending into the second surface of the second substrate but not reaching the first surface of the second substrate. The first substrate second surface is mounted to the second substrate first surface such that each of the first contact pads is electrically coupled to at least one of the second contact pads.

Claims

1. A method of forming a sensor device, comprising:

providing a first substrate of semiconductor material that comprises;

opposing first and second surfaces,

a plurality of photodetectors configured to receive light impinging on the first surface, and

a plurality of first contact pads each electrically coupled to at least one of the plurality of photodetectors;

providing a second substrate that comprises;

opposing first and second surfaces,

electrical circuits, and

a plurality of second contact pads each electrically coupled to at least one of the electrical circuits;

forming a plurality of first trenches into the second surface of the second substrate but not reaching the first surface of the second substrate;

mounting the second surface of the first substrate to the first surface of the second substrate;

providing a third substrate that comprises;

opposing first and second surfaces,

a plurality of third contact pads disposed at the first surface of the third substrate, and

a plurality of fourth contact pads disposed at the first surface of the third substrate;

mounting the first surface of the third substrate to the second surface of the second substrate such that each of the second contact pads is electrically coupled to at least one of the third contact pads; and

electrically connecting a plurality of wires between the first contact pads and the fourth contact pads.

2. The method of claim 1, further comprising:

forming a cavity into the first surface of the third substrate, wherein at least a portion of the second substrate is disposed in the cavity.

3. The method of claim 1, further comprising:

forming a through hole that extends between the first and second surfaces of the third substrate, wherein at least a portion of the second substrate is disposed in the through hole.

4. The method of claim 3, further comprising:

mounting a fourth substrate to the second surface of the second substrate, wherein the fourth substrate covers the first trenches.

5. The method of claim 1, further comprising:

forming one or more second trenches into the first surface of the first substrate, wherein the first plurality of contact pads are disposed in the one or more second trenches.

6. The method of claim 1, further comprising:

forming one or more second trenches into the second surface of the second substrate, wherein the second plurality of contact pads are disposed in the one or more second trenches.