Semiconductor structure with stress-reducing buffer structure
First Claim
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1. A semiconductor structure comprising:
- a substrate;
a buffer structure located adjacent to the substrate, the buffer structure including;
a buffer layer, wherein the buffer layer has a first side adjacent to the substrate, the first side including a plurality of islands of a first nitride-based material laterally separated from any other semiconductor material and a second side opposite the first side at which the islands are coalesced into a single layer of the first nitride-based material, wherein the coalesced portion of the buffer layer has a thickness in a range of approximately 100 Angstroms to approximately 100 microns; and
a set of semiconductor layers formed adjacent to the buffer structure, wherein the buffer structure is configured such that an overall stress in the set of semiconductor layers at room temperature is compressive and is in a range between approximately 0.1 GPa and 2.0 GPa.
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Abstract
A semiconductor structure comprising a buffer structure and a set of semiconductor layers formed adjacent to a first side of the buffer structure is provided. The buffer structure can have an effective lattice constant and a thickness such that an overall stress in the set of semiconductor layers at room temperature is compressive and is in a range between approximately 0.1 GPa and 2.0 GPa. The buffer structure can be grown using a set of growth parameters selected to achieve the target effective lattice constant a, control stresses present during growth of the buffer structure, and/or control stresses present after the semiconductor structure has cooled.
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Citations
20 Claims
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1. A semiconductor structure comprising:
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a substrate; a buffer structure located adjacent to the substrate, the buffer structure including; a buffer layer, wherein the buffer layer has a first side adjacent to the substrate, the first side including a plurality of islands of a first nitride-based material laterally separated from any other semiconductor material and a second side opposite the first side at which the islands are coalesced into a single layer of the first nitride-based material, wherein the coalesced portion of the buffer layer has a thickness in a range of approximately 100 Angstroms to approximately 100 microns; and a set of semiconductor layers formed adjacent to the buffer structure, wherein the buffer structure is configured such that an overall stress in the set of semiconductor layers at room temperature is compressive and is in a range between approximately 0.1 GPa and 2.0 GPa. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. An optoelectronic device comprising:
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a substrate; a buffer structure located adjacent to the substrate, the buffer structure including; a buffer layer, wherein the buffer layer has a first side adjacent to the substrate, the first side including a plurality of islands of a first semiconductor material laterally separated from any other semiconductor material and a second side opposite the first side at which the islands are coalesced into a single layer, wherein the coalesced portion of the buffer layer has a thickness in a range of approximately 100 Angstroms to approximately 100 microns; and a set of semiconductor layers formed adjacent to the buffer structure, wherein the buffer structure is configured such that an overall stress in the set of semiconductor layers at room temperature is compressive and is in a range between approximately 0.1 GPa and 2.0 GPa, wherein the set of semiconductor layers include; an n-type layer located on the buffer structure; an active region located on a side of the n-type layer opposite the buffer structure; and a p-type layer located on a side of the active region opposite the n-type layer. - View Dependent Claims (14, 15, 19, 20)
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16. An optoelectronic device comprising:
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a substrate; a nitride-based buffer structure located adjacent to the substrate, the buffer structure including; a buffer layer, wherein the buffer layer has a first side including a plurality of islands of a first nitride-based semiconductor material laterally separated from any other semiconductor material and a second side opposite the first side at which the islands are coalesced into a single layer, wherein the coalesced portion of the buffer layer has a thickness in a range of approximately 100 Angstroms to approximately 100 microns; and an intermediate layer located immediately adjacent to the second side of the buffer layer, wherein the intermediate layer comprises a plurality of group III nitride-based sub-layers; and a set of group III nitride-based semiconductor layers formed adjacent to the intermediate layer, wherein the buffer structure has an effective lattice constant and a thickness such that an overall stress in the set of semiconductor layers at room temperature is compressive and is in a range between approximately 0.1 GPa and 2.0 GPa, wherein the set of semiconductor layers include; a group III nitride-based n-type layer located on the buffer structure; a group III nitride-based active region located on a side of the n-type layer opposite the buffer structure, wherein the active region is configured to emit ultraviolet radiation; and a group III nitride-based p-type layer located on a side of the active region opposite the n-type layer. - View Dependent Claims (17, 18)
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Specification