Electronic component

• US 10,199,731 B2
• Filed: 03/10/2017
• Issued: 02/05/2019
• Est. Priority Date: 12/09/2013
• Status: Active Grant

• Current Assignee: Siliconware Precision Industries Co., Ltd. (ASE Technology Holding Co., Ltd.)
• Original Assignee: Siliconware Precision Industries Co., Ltd. (ASE Technology Holding Co., Ltd.)
• Inventors: Chiu, Chih-Hsien, Chu, Heng-Cheng, Chiang, Cheng-Yu
• Primary Examiner(s): Phan, Tho G
• Application Number:
  US15/455,664
• Publication Number:
  US 20170187117A1
• Time in Patent Office: 697 Days
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 1/40 Radiating elements coated with or embedded in protective material
• CPC Class Codes: H01Q 9/0421 with a shorting wall or a shorting pin at one end of the element H01Q9/0414 takes precedence

Abstract

An electronic component is provided, which includes a substrate having opposite first and second surfaces and an antenna structure combined with the substrate. The antenna structure has at least a first extending portion disposed on the first surface of the substrate, at least a second extending portion disposed on the second surface of the substrate, and a plurality of connecting portions disposed in the substrate for electrically connecting the first extending portion and the second extending portion. Any adjacent ones of the connecting portions are connected through one of the first extending portion and the second extending portion. As such, the antenna structure becomes three-dimensional. The present invention does not need to provide an additional region on the substrate for disposing the antenna structure, thereby reducing the width of the substrate so as to meet the miniaturization requirement of the electronic component.

Claims

1. An electronic component, comprising:

a substrate having opposite first and second surfaces;

an antenna structure combined with the substrate, wherein the antenna structure has a plurality of extending portions separately arranged in a direction from the first surface of the substrate toward the second surface of the substrate and a plurality of connecting portions disposed in the substrate for electrically connecting the extending portions, the connecting portions being arranged in an alternate staggered pattern in the direction from the first surface of the substrate toward the second surface of the substrate; and

an antenna body disposed on the second surface of the substrate, wherein the antenna body has at least a support portion disposed on the second surface of the substrate and an external connecting portion connected to the support portion so as to be supported by the support portion over the second surface of the substrate, the external connecting portion of the antenna body being electrically connected to the connecting portions of the antenna structure.

2. The component of claim 1, wherein the substrate further has a side surface adjacent to the first surface and the second surface, and the connecting portions are exposed from the side surface of the substrate.

3. The component of claim 1, wherein the antenna structure further has an action portion disposed on the second surface of the substrate.

4. The component of claim 3, wherein the action portion has a ground portion and a feeding portion.

5. The component of claim 1, wherein the support portion is electrically connected to the connecting portions.

6. The component of claim 1, wherein the support portion is electrically connected to the extending portions.

7. The component of claim 1, further comprising an encapsulant formed on the second surface of the substrate.