Apparatus and methods for on-die temperature sensing to improve FPGA performance

• US 10,200,037 B2
• Filed: 07/10/2017
• Issued: 02/05/2019
• Est. Priority Date: 07/07/2009
• Status: Active Grant

• Current Assignee: Altera Corporation (Intel Corporation)
• Original Assignee: Altera Corporation (Intel Corporation)
• Inventors: Perisetty, Srinivas
• Primary Examiner(s): A, Minh D
• Assistant Examiner(s): Cho, James H
• Application Number:
  US15/645,446
• Publication Number:
  US 20170373690A1
• Time in Patent Office: 575 Days
• Field of Search: None
• CPC Class Codes: H01L 23/34 Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements thermal treatment apparatus H01L21/00
• CPC Class Codes: H01L 28/00 Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor testing or measuring during manufacture H01L22/00; integration methods H01L21/70; integrated circuits H01L27/00; two-terminal components with a potential-jump or surface barrier H01L29/00; resistors in general H01C; inductors in general H01F; capacitors in general H01G
• CPC Class Codes: H03K 19/00369 Modifications for compensating variations of temperature, supply voltage or other physical parameters

Abstract

A field programmable gate array (FPGA) includes a temperature sensor array. The FPGA also includes a supply voltage modulation circuit. The supply voltage modulation circuit is coupled to the temperature sensor array.

Claims

1. An integrated circuit device comprising:

a field programmable gate array (FPGA) fabric;

one or more on-chip temperature sensors configured to detect temperature of the FPGA fabric; and

supply voltage modulation control circuitry configured to control a first voltage of the integrated circuit device to be a higher voltage at a first time when the temperature indicates that less heat is present on the FPGA fabric and to be a lower voltage at a second time when the temperature indicates that more heat is present on the FPGA fabric, wherein the first voltage comprises an internal core supply voltage to a first portion of the integrated circuit device, and wherein the supply voltage modulation control circuitry is configured to modulate the internal core supply voltage but not to modulate a second voltage supplied to a second portion of the integrated circuit device.

2. The integrated circuit device of claim 1, wherein the one or more on-chip temperature sensors comprise more than one on-chip temperature sensor.

3. The integrated circuit device of claim 1, wherein the one or more on-chip temperature sensors comprise one or more diodes.

4. The integrated circuit device of claim 1, wherein the supply voltage modulation control circuitry is configured to operate as a closed-loop system.

5. The integrated circuit device of claim 1, wherein the integrated circuit device is configured to operate over a range of temperatures at least as low as −

40 degrees Celsius.

6. The integrated circuit device of claim 1, wherein the integrated circuit device is configured to operate over a range of temperatures at least as high as 85 degrees Celsius.

7. The integrated circuit device of claim 1, wherein the supply voltage modulation control circuitry is connected to the one or more on-chip temperature sensors.

8. A method comprising:

using one or more on-chip temperature sensors of an integrated circuit device to obtain a first signal responsive to temperature of field programmable gate array (FPGA) fabric of the integrated circuit device;

using supply voltage modulation control circuitry to control at least two supply voltages of the integrated circuit device to have a higher voltage level when the first signal indicates lower heat dissipation, wherein the at least two supply voltages comprise an internal supply voltage of the FPGA fabric and a supply voltage of memory of the integrated circuit device; and

using the supply voltage modulation control circuitry to control the internal supply voltage of the FPGA fabric and the supply voltage of the memory of the integrated circuit device to have a lower level when the first signal indicates higher heat.

9. The method of claim 8, wherein obtaining the first signal comprises obtaining an analog signal corresponding to the temperature of the FPGA fabric.

10. The method of claim 8, wherein the internal supply voltage of the FPGA fabric comprises an internal core supply voltage of the FPGA fabric.

11. The method of claim 8, wherein the internal supply voltage of the FPGA fabric comprises a positive supply voltage of the FPGA fabric.

12. The method of claim 8, comprising receiving a representation of the first signal into the supply voltage modulation control circuitry via a connection to the one or more on-chip temperature sensors.

13. The method of claim 8, wherein using the supply voltage modulation control circuitry comprises operating the supply voltage modulation control circuitry as a closed-loop system.

14. A system comprising:

field programmable gate array (FPGA) circuitry disposed on an integrated circuit;

a processor configured to receive and process data from the FPGA circuitry;

on-chip temperature sensing circuitry disposed on the integrated circuit, wherein the on-chip temperature sensing circuitry is configured to detect temperature of the FPGA circuitry; and

on-chip supply voltage modulation control circuitry disposed on the integrated circuit, wherein the on-chip supply voltage modulation control circuitry is connected to the on-chip temperature sensing circuitry and configured to receive a signal corresponding to the temperature of the FPGA circuitry from the on-chip temperature sensing circuitry, and wherein the on-chip supply voltage modulation control circuitry is configured to control a first voltage of the integrated circuit and a second voltage of the integrated circuit to be at a lower voltage level when the temperature indicates that more heat is present on the FPGA circuitry and to be at a higher voltage level when the temperature indicates that less heat is present on the FPGA circuitry, wherein the first voltage comprises an internal supply voltage to programmable logic of the FPGA circuitry, and wherein the second voltage comprises a supply voltage for block memory of the FPGA circuitry.

15. The system of claim 14, wherein the processor is disposed on the integrated circuit.

16. The system of claim 15, wherein the on-chip temperature sensing circuitry is configured to detect a temperature of the processor, and wherein the on-chip supply voltage modulation control circuitry is configured to control the first voltage of the first integrated circuit to be at the lower voltage level when the temperature indicates that more heat is present on the FPGA circuitry and the processor and to be at the higher voltage level when the temperature indicates that less heat is present on the FPGA circuitry and the processor.

17. The system of claim 14, comprising communication circuitry configured to communicate with circuits external to the integrated circuit.

18. The system of claim 14, comprising a memory controller configured to communicate with a memory device external to the integrated circuit.

19. The system of claim 14, wherein the on-chip temperature sensing circuitry comprises a plurality of on-chip temperature sensors.