Light emitting diode heatsink

• US 10,201,041 B2
• Filed: 08/21/2017
• Issued: 02/05/2019
• Est. Priority Date: 09/30/2016
• Status: Active Grant

• Current Assignee: Hp Scitex Ltd. (HP Inc.)
• Original Assignee: Hp Scitex Ltd. (HP Inc.)
• Inventors: Veis, Alex
• Primary Examiner(s): Vanore, David A
• Application Number:
  US15/681,744
• Publication Number:
  US 20180098383A1
• Time in Patent Office: 533 Days
• Field of Search: 16510421, 16510433, 165 803, 165185, 165 802, 165151, 165181, 165 67, 361700, 361697, 361703, 361704, 361709, 361719, 361679, 36167952, 36167954, 361701, 361710, 257 88, 174 152, 174 163, 313 46
• CPC Class Codes: B41J 11/0021 using irradiation
• CPC Class Codes: B41J 11/00214 using UV radiation
• CPC Class Codes: B41J 11/00216 using infrared [IR] radiation or microwaves
• CPC Class Codes: F27D 11/12 with electromagnetic fields acting directly on the material being heated
• CPC Class Codes: H05B 3/0033 Heating devices using lamps
• CPC Class Codes: H05B 3/0066 for photocopying
• CPC Class Codes: H05B 3/009 heating devices not specially adapted for a particular application
• CPC Class Codes: H05K 7/20254 Cold plates transferring heat from heat source to coolant

Abstract

An example heating apparatus comprises a light emitting diode (LED) array comprising at least one LED to heat a target object. The heating apparatus further comprises a heatsink thermally coupled to the LED array to dissipate heat from the LED array. The heatsink comprises a refrigerant path including an input to and an output from the refrigerant path to pass cooled refrigerant therethrough.

Claims

1. A heating apparatus comprising:

a light emitting diode (LED) array comprising an LED to heat a target object;

a heatsink thermally coupled to the LED array, to dissipate heat from the LED array, the heatsink comprising a refrigerant path including an input to and an output from the refrigerant path to pass cooled refrigerant therethrough; and

a refrigeration system comprising a condenser to condense a refrigerant responsive to cooling caused by a flow of air over the condenser, the condenser to heat the flow of air, and the refrigeration system to supply the heated flow of air to the target object.

2. The heating apparatus of claim 1, wherein the refrigerant path comprises a through hole formed in the heatsink.

3. The heating apparatus of claim 1, wherein the refrigerant path comprises a channel formed in a surface of the heatsink.

4. The heating apparatus of claim 1, further comprising:

a conduit to receive the cooled refrigerant;

wherein the cooled refrigerant is to pass through the refrigerant path via the conduit.

5. The heating apparatus of claim 1, wherein the refrigeration system further comprises:

a compressor to compress the refrigerant to produce heated refrigerant, wherein the condenser is to condense the heated refrigerant responsive to the flow of air.

6. The heating apparatus of claim 5, wherein the refrigeration system further comprises:

an expansion valve to receive refrigerant condensed by the condenser, to produce the cooled refrigerant.

7. The heating apparatus of claim 1, wherein the heated flow of air is to heat the target object in addition to heating applied by the LED array.

8. The heating apparatus of claim 1, wherein the LED array is attached to the heatsink through a thermally conductive layer.

9. An apparatus comprising:

a light emitting diode (LED) array comprising an LED to heat a target object;

a heatsink thermally coupled to the LED array, the heatsink comprising a refrigerant path; and

a refrigeration system configured to;

cool a refrigerant within the refrigeration system that comprises a condenser to condense a portion of the refrigerant; and

pass the cooled refrigerant through the refrigerant path such that heat from the LED array is transferred to the cooled refrigerant via the heatsink;

supply a flow of air to the condenser to heat the flow of air; and

supply the heated flow of air to the target object.

10. The apparatus of claim 9, further comprising:

a conduit, the refrigeration system configured to pass the cooled refrigerant through the refrigerant path via the conduit,

wherein heat from the heatsink is transferred to the cooled refrigerant via the conduit.

11. The apparatus of claim 9, wherein the refrigeration system further comprises:

a compressor configured to compress a portion of the refrigerant; and

an expansion valve configured to decrease the pressure of a portion of the refrigerant, thereby cooling the refrigerant.

12. The apparatus of claim 9, wherein the LED array is attached to the heatsink through a thermally conductive layer.

13. A non-transitory computer readable storage medium comprising computer-readable instructions stored thereon, which, when executed by a processor, cause the processor to:

cause a refrigeration system to cool a refrigerant;

cause the refrigeration system to supply the cooled refrigerant to a heatsink;

cause the cooled refrigerant to pass through one or more refrigerant paths formed in the heatsink, such that heat from a light emitting diode (LED) array, thermally coupled to the heatsink, is transferred to the cooled refrigerant via the heatsink; and

cause a flow of air to be heated by a condenser in the refrigeration system, wherein the flow of heated air is supplied to a target being heated by the LED array.

14. A method of manufacturing a heating apparatus, the heating apparatus comprising:

a light emitting diode (LED) array to heat a target object; and

a heatsink;

the method comprising;

forming one or more refrigerant paths in the heatsink;

thermally coupling the LED array to the heatsink to allow heat to be transferred from the LED array, via the heatsink, to a refrigerant passing along the one or more refrigerant paths; and

passing an object through a first conduit of one or more conduits, the object having a diameter greater than a diameter of the first conduit, wherein passing the object through the first conduit causes the diameter of the first conduit to increase, thereby increasing thermal coupling between the first conduit and the heatsink.

15. The method of claim 14, wherein forming the one or more refrigerant paths comprises:

providing one or more channels in a surface of the heatsink.

16. The method of claim 14, wherein forming the one or more refrigerant paths comprises:

providing one or more through holes in the heatsink.

17. The method of claim 16 further comprising:

inserting the one or more conduits into the one or more through holes.

18. The method of claim 14, wherein passing the object through the first conduit comprises passing a ball through the first conduit.

19. The method of claim 18, wherein passing the ball through the first conduit comprises passing a metal ball through the first conduit.