Microfluidic devices for liquid chromatography-mass spectrometry and microscopic imaging
First Claim
Patent Images
1. An apparatus comprising:
- a first wafer;
a second wafer, the first and second wafers comprising silicon wafers and defining a sample input hole, the second wafer defining a first portion of a first channel, the first channel including a first end and a second end, the first end of the first channel proximate to and fluidly coupled to the sample input hole, the first channel configured to contain separation media;
an emitter, the emitter being disposed between the first wafer and the second wafer, the second end of the first channel proximate to and fluidly coupled to the emitter; and
a transparent wafer being an optically transparent glass wafer configured to define a second portion of the first channel, the transparent wafer being bonded to a bottom surface of the second wafer, wherein the bond is an anodic silicon-glass bond, and wherein the first wafer, the second wafer, and the transparent wafer are monolithically integrated,the transparent wafer being further configured to be transparent along the second portion of the first channel to provide an imaging window of an entirety of the separation media included in the first channel, wherein the second wafer is disposed between the first wafer and the transparent wafer.
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Abstract
Systems, methods, and apparatus provide integration of microscopic imaging and liquid chromatography-mass spectrometry on a microfluidic device. In one aspect, an apparatus includes a first wafer, a second wafer, and an emitter. The emitter is disposed between the first wafer and the second wafer. The first wafer defines a sample input hole. The first wafer and the second wafer define a first channel, the first channel including a first end and a second end. The first end of the first channel is proximate the sample input hole. The first channel is configured to contain separation media. The second end of the first channel is proximate the emitter.
38 Citations
16 Claims
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1. An apparatus comprising:
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a first wafer; a second wafer, the first and second wafers comprising silicon wafers and defining a sample input hole, the second wafer defining a first portion of a first channel, the first channel including a first end and a second end, the first end of the first channel proximate to and fluidly coupled to the sample input hole, the first channel configured to contain separation media; an emitter, the emitter being disposed between the first wafer and the second wafer, the second end of the first channel proximate to and fluidly coupled to the emitter; and a transparent wafer being an optically transparent glass wafer configured to define a second portion of the first channel, the transparent wafer being bonded to a bottom surface of the second wafer, wherein the bond is an anodic silicon-glass bond, and wherein the first wafer, the second wafer, and the transparent wafer are monolithically integrated, the transparent wafer being further configured to be transparent along the second portion of the first channel to provide an imaging window of an entirety of the separation media included in the first channel, wherein the second wafer is disposed between the first wafer and the transparent wafer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. An apparatus comprising:
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an emitter; a first wafer; a second wafer, the first and second wafers comprising silicon wafers, the first wafer and the second wafer defining a sample input hole, the first wafer and the second wafer defining a first exit channel having a first end and a second end, the emitter being disposed between the first wafer and the second wafer, the second end of the first exit channel proximate to and fluidly coupled to the emitter; and a transparent wafer being an optically transparent glass wafer, the second wafer and the transparent wafer defining a first channel having a first end and a second end, the first end of the first channel proximate to and fluidly coupled to the sample input hole, the second end of the first channel proximate to and fluidly coupled to the first end of the first exit channel, the first channel being configured to contain separation media, wherein the transparent wafer is bonded to a bottom surface of the second wafer, wherein the bond is an anodic silicon-glass bond, wherein the first wafer, the second wafer, and the transparent wafer are monolithically integrated, wherein the transparent wafer is configured to be transparent along the first channel to provide an imaging window of an entirety of the separation media included in the first channel, and wherein the second wafer is disposed between the first wafer and the transparent wafer. - View Dependent Claims (14, 15, 16)
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Specification