Dielectric stack, an isolator device and method of forming an isolator device

• US 10,204,732 B2
• Filed: 06/10/2016
• Issued: 02/12/2019
• Est. Priority Date: 10/23/2015
• Status: Active Grant

• Current Assignee: Analog Devices International Unlimited Company (Analog Devices, Inc.)
• Original Assignee: Analog Devices Global Unlimited Company (Analog Devices, Inc.)
• Inventors: Murphy, Patrick J., O'Brien, Stephen, Carroll, Sarah, Stenson, Bernard P., Mcloughlin, Conor John, Osiak, Michal J.
• Primary Examiner(s): Nguyen, Tuyen
• Application Number:
  US15/179,741
• Publication Number:
  US 20170117084A1
• Time in Patent Office: 977 Days
• Field of Search: 336 65, 336200, 336232, 336206-208, 257531
• CPC Class Codes: H01B 17/62 Insulating-layers or insulating-films on metal bodies
• CPC Class Codes: H01B 19/04 Treating the surfaces, e.g. applying coatings
• CPC Class Codes: H01B 3/12 ceramics
• CPC Class Codes: H01B 3/306 Polyimides or polyesterimides
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H01F 41/041 Printed circuit coils apparatus or processes for manufacturing printed circuits in general H05K3/00
• CPC Class Codes: H01F 5/00 Coils superconducting coils H01F6/06; fixed inductances of the signal type H01F17/00
• CPC Class Codes: H01L 23/5227 Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 23/53295 Stacked insulating layers
• CPC Class Codes: H01L 23/562 Protection against mechanical damage H01L23/02, H01L23/28 take precedence
• CPC Class Codes: H01L 33/44 characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

An isolator device is provided comprising a body of first dielectric material between the first and second conductors, such as primary and secondary coils of a micro-transformer. A region of second dielectric material is provided between the body of first dielectric material and at least one of the first and second electrodes, wherein the second dielectric material has a higher relative permittivity than the first dielectric material. This provides enhances ability to withstand the Electric fields generated at the edge of a conductor. The body of the first dielectric can be tapered to provide stress relief to prevent the second dielectric material developing stress cracks.

Claims

1. An isolator comprising:

a first layer of a first dielectric material formed adjacent a substrate;

a second layer of the first dielectric material formed on the first layer, wherein the second layer is delimited by a periphery and at least some parts of the second layer do not extend to or beyond a periphery of the first layer;

a layer of a second dielectric material formed over an uppermost one of the first and second layers of the first dielectric material, wherein the layer of the second dielectric material has a higher permittivity than the first dielectric material.

2. The isolator of claim 1, in which a spatial extent of the second layer is contained within a spatial extent of the first layer.

3. The isolator of claim 2, in which the spatial extent of the second layer is less than the spatial extent of the first layer.

4. The isolator of claim 1, further including a third layer of the first dielectric material, and where a spatial extent of the third layer is contained within a spatial extent of the second layer and is less than the spatial extent of the second layer.

5. The isolator of claim 1, in which at least one of the following apply:

a) the layer of second dielectric material includes stress relief structures formed therein; and

/or b) a spatial extent of the layer of the second dielectric material is less than or equal to a spatial extent of a contiguous portion of the first dielectric material.

6. The isolator of claim 1, in which the layer of the second dielectric includes one or more slots formed therein and intermediate conductive structures formed over the layer of the second dielectric.

7. The isolator of claim 1, in which a first conductor of the isolator is formed beneath the first layer of the first dielectric material and a second conductor of the isolator is formed above an uppermost layer of the first dielectric material.

8. The isolator of claim 7, in which the isolator comprises a transformer having primary and secondary windings, and the first layer, the second layer, and the layer of the second dielectric material are disposed between the primary and secondary windings.

9. The isolator of claim 1, wherein said first dielectric material is polyimide, and/or said second dielectric material is one of silicon nitride, silicon dioxide, sapphire, tantalum pentoxide, strontium titanate, bismuth ferrite and barium strontium titinate.

10. An isolator device comprising:

first and second conductors;

a layer of first dielectric material between the first and second conductors; and

at least one region of second dielectric material between the layer of first dielectric material and at least the second conductor;

wherein the second dielectric material has a higher relative permittivity than the first dielectric material and wherein one of the layer of the first dielectric and the region of second dielectric material includes a stress relief structure.

11. The device of claim 10, wherein the at least one region of second dielectric material is located proximate an edge of the second conductor, and extends beyond the edge by a guard distance.

12. The device of claim 10, further comprising a further layer between said at least one region of second dielectric material and said at least one of the first and second conductors.

13. The device of claim 12, wherein said further layer is a passivation layer.

14. The device of claim 10, wherein each of said first and second conductors comprises a plate or a coil.

15. The device of claim 10, wherein a thickness of said layer of first dielectric material is between around 10 μ

m and around 80 μ

m.

16. The device of claim 10, wherein a thickness of said at least one region of second dielectric material is around 1 μ

m.

17. The device of claim 10 wherein said at least one region of second dielectric material substantially surrounds said layer of first dielectric material.

18. An electronic device including an isolator device as claimed in claim 10.