Systems and methods for forming thermoelectric devices
First Claim
1. A method for forming a thermoelectric element, comprising:
- (a) providing a mask adjacent to a substrate, said mask comprising a polymeric mixture;
(b) bringing a template having a first pattern comprising rods in contact with said mask to define a second pattern in said mask, wherein said second pattern exposes portions of said substrate through said mask;
(c) depositing an etch block layer on said portions of said substrate exposed through said mask, wherein said etch block layer comprises a first metallic material, and removing said mask;
(d) subsequent to removing said mask, depositing an etching layer adjacent to said substrate, wherein said etching layer comprises metallic particles comprising a second metallic material configured to catalytically etch said substrate, wherein said first metallic material is configured to limit or prevent etching of said substrate that is facilitated by said second metallic material; and
(e) using said metallic particles to catalytically etch said substrate to form holes in said substrate, thereby forming said thermoelectric element.
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0 Petitions
Accused Products
Abstract
A method for forming a thermoelectric element for use in a thermoelectric device comprises providing a mask adjacent to a substrate, the mask comprising a polymeric mixture, and bringing a template having a first pattern in contact with the mask to define a second pattern in the mask. The first pattern comprises one of holes and rods, and the second pattern comprises the other of holes and rods. Holes or rods of the second pattern expose portions of the substrate. Next, an etching layer is deposited adjacent to exposed portions of the substrate. The etching layer is configured to aid in etching the substrate. The substrate is subsequently etched with the aid of the etching layer.
111 Citations
20 Claims
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1. A method for forming a thermoelectric element, comprising:
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(a) providing a mask adjacent to a substrate, said mask comprising a polymeric mixture; (b) bringing a template having a first pattern comprising rods in contact with said mask to define a second pattern in said mask, wherein said second pattern exposes portions of said substrate through said mask; (c) depositing an etch block layer on said portions of said substrate exposed through said mask, wherein said etch block layer comprises a first metallic material, and removing said mask; (d) subsequent to removing said mask, depositing an etching layer adjacent to said substrate, wherein said etching layer comprises metallic particles comprising a second metallic material configured to catalytically etch said substrate, wherein said first metallic material is configured to limit or prevent etching of said substrate that is facilitated by said second metallic material; and (e) using said metallic particles to catalytically etch said substrate to form holes in said substrate, thereby forming said thermoelectric element. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification