Closed loop temperature controlled circuit to improve device stability
First Claim
Patent Images
1. A wireless device, comprising:
- a battery;
an antenna coupled to the battery; and
an integrated circuit package coupled to the antenna and the battery, the integrated circuit package including;
a semiconductor die;
an active circuit in the semiconductor die;
a temperature sensor in the semiconductor die, the temperature sensor configured to measure a temperature of the active circuit;
a heating element configured to heat the active circuit; and
a temperature controller configured to receive temperature data from the temperature sensor and data regarding a level of use of the active circuit from the active circuit, and to cause the heating element to heat the active circuit to maintain the temperature of the active circuit above a minimum threshold temperature and below a maximum threshold temperature based on the temperature data received from the temperature sensor and the data regarding the level of use of the active circuit received from the active circuit.
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Abstract
An integrated circuit is provided having an active circuit. A heating element is adjacent to the active circuit and configured to heat the active circuit. A temperature sensor is also adjacent to the active circuit and configured to measure a temperature of the active circuit. A temperature controller is coupled to the active circuit and configured to receive a temperature signal from the temperature sensor. The temperature controller operates the heating element to heat the active circuit to maintain the temperature of the active circuit in a selected temperature range.
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Citations
20 Claims
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1. A wireless device, comprising:
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a battery; an antenna coupled to the battery; and an integrated circuit package coupled to the antenna and the battery, the integrated circuit package including; a semiconductor die; an active circuit in the semiconductor die; a temperature sensor in the semiconductor die, the temperature sensor configured to measure a temperature of the active circuit; a heating element configured to heat the active circuit; and a temperature controller configured to receive temperature data from the temperature sensor and data regarding a level of use of the active circuit from the active circuit, and to cause the heating element to heat the active circuit to maintain the temperature of the active circuit above a minimum threshold temperature and below a maximum threshold temperature based on the temperature data received from the temperature sensor and the data regarding the level of use of the active circuit received from the active circuit. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A wireless device, comprising:
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a battery; an antenna circuit coupled to the battery; a display circuit coupled to the battery; and an integrated circuit package coupled to the antenna circuit and the battery, the integrated circuit package including; a semiconductor die; an active circuit in the semiconductor die; a temperature sensor in the semiconductor die, the temperature sensor configured to measure a temperature of the active circuit; a heating element configured to heat the active circuit; and a temperature controller configured to receive temperature data from the temperature sensor and data regarding a level of use of the active circuit from the active circuit, and to cause the heating element to heat the active circuit to maintain the temperature of the active circuit above a minimum threshold temperature and below a maximum threshold temperature based on the temperature data received from the temperature sensor and the data regarding the level of use of the active circuit received from the active circuit. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A wireless device, comprising:
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a battery; an antenna circuit coupled to the battery; and an integrated circuit package coupled to the antenna circuit and the battery, the integrated circuit package including; a semiconductor die; an active circuit in the semiconductor die; a temperature sensor in the semiconductor die, the temperature sensor configured to measure a temperature of the active circuit; a dielectric stack on a surface of the semiconductor die; a heating element in the dielectric stack, the heating element configured to heat the active circuit; and a temperature controller configured to receive temperature data from the temperature sensor and data regarding a level of use of the active circuit from the active circuit, and to cause the heating element to heat the active circuit to maintain the temperature of the active circuit in a selected range of temperatures by controlling an amount of current in the heating element based on the temperature data received from the temperature sensor and the data regarding the level of use of the active circuit received from the active circuit. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification